يعرض 1 - 10 نتائج من 244 نتيجة بحث عن '"Zhu, Fulong"', وقت الاستعلام: 1.56s تنقيح النتائج
  1. 1
    مؤتمر
    The Effect of Cu/SiO2 Rough Interface on TSV Electroplating Process for Electronic Packaging

    المؤلفون: Lv, Weishan, Lei, Xin, Liu, Jiaxin, Zhu, Fulong

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :1086-1089 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  2. 2
    مؤتمر
    The Effect of Filler Mass Fraction on The Physical Properties of Conductive Silver Adhesives

    المؤلفون: Yu, Ziniu, Lv, Weishan, Zhu, Fulong

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :459-463 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  3. 3
    مؤتمر
    Evolution of Nano-notches on the Surface of SiC with Different Crystal Forms during Cutting in the Water Environment

    المؤلفون: Zhou, Yuqi, Lv, Weishan, Zhu, Fulong

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :1075-1079 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  4. 4
    مؤتمر
    Effect of water film on 4H-SiC nano-indentation process

    المؤلفون: Zhou, Yuqi, Huang, Yuhua, Li, Jinming, Zhu, Fulong

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :481-485 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  5. 5
    مؤتمر
    The effect of BNNS distribution on the plastic deformation of BNNS/ Al composites during the nanoindentation

    المؤلفون: Li, Jinming, Huang, Yuhua, Zhou, Yuqi, Zhu, Fulong

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :570-574 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  6. 6
    مؤتمر
    A non-destructive inspection method for electronic packaging reliability incorporating mechanical and thermal information

    المؤلفون: Xiong, Chuanguo, Zeng, Baoshan, Huang, Yuhua, Zhu, Fulong

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :719-724 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  7. 7
    مؤتمر
    The Effect of Porosity on Thermal Properties of Nano-Silver Solder for Electronic Packaging

    المؤلفون: Lv, Weishan, Hu, Jianxiong, Zhu, Fulong

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :926-929 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  8. 8
    مؤتمر
    Effect of impurity doping on 4H-SiC planarization

    المؤلفون: Huang, Yuhua, Zhou, Yuqi, Li, Jinming, Zhu, Fulong

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  9. 9
    مؤتمر
    Molecular dynamics study of BNNS/Al composites under compression

    المؤلفون: Li, Jinming, Huang, Yuhua, Zhou, Yuqi, Zeng, Baoshen, Feng, Chenzefang, Zhu, Fulong

    المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :190-194 Dec, 2021

    Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

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  10. 10
    مؤتمر
    Mechanical Response of BNNS-reinforced Aluminum Composites under Uniaxial Compression

    المؤلفون: Li, Jinming, Huang, Yuhua, Zeng, Baoshan, Feng, Chenzefang, Zhu, Fulong

    المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021

    Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

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