المؤلفون: Nyssens, L., Rack, M., Nabet, M., Schwan, C., Zhao, Z., Lehmann, S., Herrmann, T., Henke, D., Kondrat, A., Soonekindt, C., Koch, F., Kache, T., Kini, D. P., Zimmerhackl, O., Allibert, F., Aulnette, C., Lederer, D., Raskin, J.-P.

المصدر: 2022 24th International Microwave and Radar Conference (MIKON) Microwave and Radar Conference (MIKON), 2022 24th International. :1-4 Sep, 2022

Relation: 2022 24th International Microwave and Radar Conference (MIKON)

المؤلفون: Pirro, L., Jayakumar, A., Zimmerhackl, O., Lipp, D., Illgen, R., Muehlhoff, A., Pfuetzner, R., Zaka, A., Otto, M., Hoentschel, J., Raffel, Y., Seidel, K., Olivo, R.

المصدر: 2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-4 Mar, 2021

Relation: 2021 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Jayakumar, A., Chan, N., Pirro, L., Zimmerhackl, O., Otto, M., Kleissner, T., Hoentschel, J.

المصدر: 2020 IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS) Microelectronic Test Structures (ICMTS), 2020 IEEE 33rd International Conference on. :1-5 May, 2020

Relation: 2020 IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS)

المؤلفون: Rack, M., Nyssens, L., Nabet, M., Schwan, C., Zhao, Z., Lehmann, S., Herrmann, T., Henke, D., Kondrat, A., Soonekindt, C., Koch, F., Kache, T., Kini, D. P., Zimmerhackl, O., Allibert, F., Aulnette, C., Lederer, D., Raskin, J.-P.

المصدر: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) VLSI Technology, Systems and Applications (VLSI-TSA), 2022 International Symposium on. :1-2 Apr, 2022

Relation: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)

المؤلفون: Pirro, L., Zaka, A., Morvan, S., Zimmerhackl, O., Nelluri, R., Hermann, T., Majer, M., Pagel, H., Wu, N., Otto, M., Hoentschel, J.

المصدر: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) VLSI Technology, Systems and Applications (VLSI-TSA), 2022 International Symposium on. :1-2 Apr, 2022

Relation: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)

المؤلفون: Pirro, L., Zaka, A., Zimmerhackl, O., Herrmann, T., Otto, M., Bazizi, El M., Hoentschel, J., Li, X., Taylor, R.

المصدر: 2019 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2019 IEEE International. :1-5 Mar, 2019

Relation: 2019 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Pirro, L., Liebscher, P., Brantz, C., Kessler, M., Herzog, H., Zimmerhackl, O., Jain, R., Ebrand, E., Gebauer, K., Otto, M., Zaka, A., Hoentschel, J.

المصدر: 2022 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2022 IEEE International. :P59-1-P59-5 Mar, 2022

Relation: 2022 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Pirro, L., Zimmerhackl, O., Zaka, A., Miiller-Meskamp, L., Nelluri, R., Hermann, T., Cortes-Mayol, I., Huschka, A., Otto, M., Nowak, E., Mittal, A., Hoentschel, J.

المصدر: 2018 48th European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), 2018 48th European. :254-257 Sep, 2018

Relation: ESSDERC 2018 - 48th European Solid-State Device Research Conference (ESSDERC)

المؤلفون: Nyssens, L., Rack, M., Nabet, M., Schwan, C., Zhao, Z., Lehmann, S., Herrmann, T., Henke, D., Kondrat, A., Soonekindt, C., Koch, F., Kache, T., Kini, D.P., Zimmerhackl, O., Allibert, F., Aulnette, C., Lederer, D., Raskin, J.-P.

المصدر: In Solid State Electronics July 2023 205

المؤلفون: Zimmerhackl, O., Rothe, J., Schmidt, K., Marshall, L., Honold, A.

المصدر: 2007 International Symposium on Semiconductor Manufacturing; 2007, p1-5, 5p