المؤلفون: Ramirez-Como, Magaly, Sacramento, Angel, Hernandez-Garcia, Liliana Fernanda, Pallares, Josep, Resendiz, Luis, Marsal, Lluis F.

المصدر: 2024 IEEE Latin American Electron Devices Conference (LAEDC) Electron Devices Conference (LAEDC), 2024 IEEE Latin American. :1-4 May, 2024

Relation: 2024 IEEE Latin American Electron Devices Conference (LAEDC)

المؤلفون: Tanishka, Jiya, Harshbardhan, Bhatt, Aditya Nath

المصدر: 2024 International Conference on Recent Advances in Electrical, Electronics, Ubiquitous Communication, and Computational Intelligence (RAEEUCCI) Recent Advances in Electrical, Electronics, Ubiquitous Communication, and Computational Intelligence (RAEEUCCI), 2024 International Conference on. :1-4 Apr, 2024

Relation: 2024 International Conference on Recent Advances in Electrical, Electronics, Ubiquitous Communication, and Computational Intelligence (RAEEUCCI)

المؤلفون: Bakian-Dogaheh, Kazem, Zhao, Yuhuan, Kimball, John S., Moghaddam, Mahta

المصدر: IGARSS 2023 - 2023 IEEE International Geoscience and Remote Sensing Symposium Geoscience and Remote Sensing Symposium, IGARSS 2023 - 2023 IEEE International. :8335-8338 Jul, 2023

Relation: IGARSS 2023 - 2023 IEEE International Geoscience and Remote Sensing Symposium

المؤلفون: Jung, Yoon Taek, Lee, Yeji, Kim, Minhwa, Park, Sang-Eun

المصدر: IGARSS 2023 - 2023 IEEE International Geoscience and Remote Sensing Symposium Geoscience and Remote Sensing Symposium, IGARSS 2023 - 2023 IEEE International. :229-232 Jul, 2023

Relation: IGARSS 2023 - 2023 IEEE International Geoscience and Remote Sensing Symposium

المؤلفون: Anabestani, Hossein, Bhadra, Sharmistha

المصدر: 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Flexible and Printable Sensors and Systems (FLEPS), 2023 IEEE International Conference on. :1-4 Jul, 2023

Relation: 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

المؤلفون: Tao, Jing, Riley, William J, Zhu, Qing

المصدر: Environmental Research Letters. 19(5)

مصطلحات موضوعية: Earth Sciences, Environmental Sciences, Soil Sciences, active layer thickness, permafrost, E3SM land model, snow thermal conductivity, soil organic matter, peat soils, Meteorology & Atmospheric Sciences

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/0qk8h4fx
https://escholarship.org/content/qt0qk8h4fx/qt0qk8h4fx.pdf

المؤلفون: Eklof, Joel F, Jones, Benjamin M, Dafflon, Baptiste, Devoie, Élise G, Ring, Katie M, English, Marie E, Waldrop, Mark P, Neumann, Rebecca B

المصدر: Environmental Research Letters. 19(4)

مصطلحات موضوعية: Hydrology, Earth Sciences, Climate Action, permafrost, ecosystem-protected, active layer, advective heat transport, precipitation, talik, thermal conductivity, Meteorology & Atmospheric Sciences

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/6qf3d73b
https://escholarship.org/content/qt6qf3d73b/qt6qf3d73b.pdf

المؤلفون: Alresheedi, Nadi Mlihan, Ghitas, Ahmed, Almutairi, Fahad N.^{Aff3, IDs10904024032140_cor3}, Shahat, M. Abdelhamid^{Aff2, IDs10904024032140_cor4}

المصدر: Journal of Inorganic and Organometallic Polymers and Materials. :1-18

المؤلفون: Moulaoui, Lhouceine, Bajjou, Omar, Najim, Abdelhafid, Rahmani, Khalid, Marouane, Archi, Laassouli, Abdelmounaim, Lachtioui, Youssef, Manaut, Bouzid

المصدر: 2023 3rd International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET) Innovative Research in Applied Science, Engineering and Technology (IRASET), 2023 3rd International Conference on. :1-7 May, 2023

Relation: 2023 3rd International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET)

المؤلفون: Huang, C., Huang, X., Yao, J., Zhang, J., Li, M., Liu, J., Zhang, M., Zhou, X., Guo, Y.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 44(5):769-772 May, 2023