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1مؤتمر
المؤلفون: Schrag, Gabriele, Bosetti, Gabriele
المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-5 Jun, 2024
Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
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2دورية أكاديمية
المؤلفون: Arakawa, G., Hirai, R., Suzuki, S., Kamigaki, T., Makino, Y., Shinoda, H.
المصدر: IEEE Access Access, IEEE. 12:84612-84621 2024
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3مؤتمر
المؤلفون: Aldahi, Mohammad, Khaheshi, Ali, Saif, Nasif Bin, Vasconez, Juan Felipe Proano, Rajabi, Hamed, Harput, Sevan
المصدر: 2023 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2023 IEEE International. :1-4 Sep, 2023
Relation: 2023 IEEE International Ultrasonics Symposium (IUS)
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4مؤتمر
المؤلفون: Bosetti, Gabriele, Bretthauer, Christian, Steinberger, Michael, Gierl, Karolina, Krenzer, Michael, Schrag, Gabriele
المصدر: 2023 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2023 IEEE International. :1-4 Sep, 2023
Relation: 2023 IEEE International Ultrasonics Symposium (IUS)
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5مؤتمر
المؤلفون: Fusco, Alessandra, Krueger, Martin, Bretthauer, Christian, Froemel, Andreas, Servadei, Lorenzo, Wille, Robert
المصدر: 2023 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2023 IEEE International. :1-4 Sep, 2023
Relation: 2023 IEEE International Ultrasonics Symposium (IUS)
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6مؤتمر
المؤلفون: Fusco, Alessandra, Krueger, Martin, Servadei, Lorenzo, Wille, Robert
المصدر: 2023 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2023 IEEE International. :1-4 Sep, 2023
Relation: 2023 IEEE International Ultrasonics Symposium (IUS)
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7مؤتمر
المؤلفون: Iwabuchi, Sota, Onishi, Ryoya, Suzuki, Shun, Kamigaki, Takaaki, Makino, Yasutoshi, Shinoda, Hiroyuki
المصدر: 2023 IEEE World Haptics Conference (WHC) World Haptics Conference (WHC), 2023 IEEE. :210-215 Jul, 2023
Relation: 2023 IEEE World Haptics Conference (WHC)
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8مؤتمر
المصدر: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Solid-State Sensors, Actuators and Microsystems (Transducers), 2023 22nd International Conference on. :873-876 Jun, 2023
Relation: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)
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9دورية أكاديمية
المؤلفون: Grimshaw-Aagaard, MarkAff1, IDs00779024017985_cor1, Bemman, Brian
المصدر: Personal and Ubiquitous Computing. :1-16
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10دورية أكاديمية
المؤلفون: Llavata, B., Femenia, A., Clemente, G., Cárcel, J. A.Aff1, IDs11947023031386_cor4
المصدر: Food and Bioprocess Technology: An International Journal. 17(2):440-451