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1مؤتمر
المصدر: 2024 Intermountain Engineering, Technology and Computing (IETC) Intermountain Engineering, Technology and Computing (IETC), 2024. :204-208 May, 2024
Relation: 2024 Intermountain Engineering, Technology and Computing (IETC)
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2مؤتمر
المؤلفون: Wu, Sheng, Li, Wei, Shao, Shuai, Yang, Heng, Wu, Tao, Li, Xinxin
المصدر: 2022 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2022 IEEE International. :1-4 Oct, 2022
Relation: 2022 IEEE International Ultrasonics Symposium (IUS)
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3مؤتمر
المؤلفون: Zhang, Jin, Zhang, Jianfeng, Shang, Jintang
المصدر: 2022 IEEE 17th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) Nano/Micro Engineered and Molecular Systems (NEMS), 2022 IEEE 17th International Conference on. :350-353 Apr, 2022
Relation: 2022 IEEE 17th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)
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4دورية أكاديمية
المؤلفون: Wu, G., Gosalvez, M.A., Xing, Y.
المصدر: Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 31(2):249-264 Apr, 2022
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5مؤتمر
المصدر: 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), 2019 20th International Conference on. :1760-1763 Jun, 2019
Relation: 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)
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6دورية أكاديمية
المؤلفون: Yunhao Wang, Sheng Wu, Wenjing Wang, Tao Wu, Xinxin Li
المصدر: Micromachines, Vol 15, Iss 4, p 482 (2024)
مصطلحات موضوعية: PMUT array, the scar-free “MIS” process, (111) wafer, anisotropic wet etching, three-fold symmetry, Mechanical engineering and machinery, TJ1-1570
وصف الملف: electronic resource
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7دورية أكاديمية
المؤلفون: Andrzej Kociubiński, Mariusz Duk, Tomasz Bieniek, Paweł Janus
المصدر: Journal of Telecommunications and Information Technology, Iss 4 (2023)
مصطلحات موضوعية: anisotropic wet etching, KOH, silicon technology, Telecommunication, TK5101-6720, Information technology, T58.5-58.64
وصف الملف: electronic resource
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8مؤتمر
المؤلفون: Yoshiba, Shuhei, Hirai, Masakazu, Ichikawa, Yukimi, Konagai, Makoto
المصدر: 2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC) Photovoltaic Specialists Conference (PVSC), 2016 IEEE 43rd. :2118-2122 Jun, 2016
Relation: 2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC)
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9مؤتمر
المصدر: 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO) Nanotechnology (IEEE-NANO) , 2015 IEEE 15th International Conference on. :963-966 Jul, 2015
Relation: 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO)
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10مؤتمر
المؤلفون: Imaeda, K., Bessho, K., Shikida, M.
المصدر: 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on. :1715-1718 Jun, 2015
Relation: TRANSDUCERS 2015 - 2015 18th International Solid-State Sensors, Actuators and Microsystems Conference