المؤلفون: Uehara, H., Iwata, S., Kitani, R., Okamoto, T., Takada, T.

المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 31(2):694-703 Apr, 2024

المؤلفون: Harith, Ashrith S, Liu, Yingdi, Mukherjee, Nilanjan, Mayer, Jeff

المصدر: 2024 37th International Conference on VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID) VLSID VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID), 2024 37th International Conference on. :718-723 Jan, 2024

Relation: 2024 37th International Conference on VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID)

المؤلفون: Çetinbaş, Melike^{Aff1, IDs10341024011451_cor1}

المصدر: Applied Fruit Science: Erwerbs-Obstbau. 66(4):1631-1640

المؤلفون: Beyza Gül, Fatma Keçeci, Hüseyin Hatirli, Gülşah Tonga

المصدر: Current Research in Dental Sciences, Vol 34, Iss 3, Pp 160-165 (2024)

مصطلحات موضوعية: quick application, application time, universal adhesive, restoration repai, Dentistry, RK1-715

وصف الملف: electronic resource

Relation: https://dergipark.org.tr/tr/download/article-file/4088470; https://doaj.org/toc/2822-2555

URL الوصول: https://doaj.org/article/bed3eba8024f43c3b4e3e81f7fc231b8

المؤلفون: Kaczmarek, B., Mrugalski, G., Mukherjee, N., Pogiel, A., Rajski, J., Rybak, L., Tyszer, J.

المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 41(7):2290-2300 Jul, 2022

المؤلفون: Ladnushkin, Maxim

المصدر: 2020 IEEE International Test Conference (ITC) Test Conference (ITC), 2020 IEEE International. :1-5 Nov, 2020

Relation: 2020 IEEE International Test Conference (ITC)

المؤلفون: Liu, Y., Milewski, S., Mrugalski, G., Mukherjee, N., Rajski, J., Tyszer, J., Włodarczak, B.

المصدر: 2020 IEEE International Test Conference (ITC) Test Conference (ITC), 2020 IEEE International. :1-10 Nov, 2020

Relation: 2020 IEEE International Test Conference (ITC)

المؤلفون: Liu, Y., Milewski, S., Mrugalski, G., Mukherjee, N., Rajski, J., Tyszer, J., Wlodarczak, B.

المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 29(8):1553-1566 Aug, 2021

المؤلفون: M. Holbak, J. Vuaille, E. Diamantopoulos, M.E. Styczen, C.T. Petersen, B.W. Strobel, P. Abrahamsen

المصدر: Journal of Hydrology: Regional Studies, Vol 53, Iss , Pp 101734- (2024)

مصطلحات موضوعية: Pesticide leaching, Drains, Mitigation, Modelling, Application time, Physical geography, GB3-5030, Geology, QE1-996.5

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S221458182400082X; https://doaj.org/toc/2214-5818

URL الوصول: https://doaj.org/article/ffd66671053548709a3822c2894de2fb

المؤلفون: Kaczmarek, Bartosz, Mrugalski, Grzegorz, Mukherjee, Nilanjan, Rajski, Janusz, Rybak, Lukasz, Tyszer, Jerzy

المصدر: 2020 IEEE European Test Symposium (ETS) European Test Symposium (ETS), 2020 IEEE. :1-6 May, 2020

Relation: 2020 IEEE European Test Symposium (ETS)