المؤلفون: Siddiki, Md Abul Kalam Azad, Kumar, Kamal, Singh, Harpreet, Mukherjee, Jibak, Tribedi, Lokesh C., Misra, Deepankar

المصدر: Journal of Chemical Physics; 6/14/2024, Vol. 160 Issue 22, p1-12, 12p

مصطلحات موضوعية: COLLISION induced dissociation, ELECTRON capture, DIMERS, COULOMB potential, BRANCHING ratios, ION pairs, ELECTRON impact ionization, AUGER effect

المؤلفون: Pratt, Stephen T., Jacovella, Ugo, Gans, Bérenger, Bozek, John D., Holland, David M. P.

المصدر: Journal of Chemical Physics; 5/7/2024, Vol. 160 Issue 17, p1-8, 8p

مصطلحات موضوعية: AUGER effect, AUGERS, METHYL iodide, EXCITED states, IODOBENZENE

المؤلفون: Szadkowski, Z., Pytel, K.

المصدر: IEEE Transactions on Nuclear Science IEEE Trans. Nucl. Sci. Nuclear Science, IEEE Transactions on. 71(6):1281-1291 Jun, 2024

المؤلفون: Pratt, Stephen T., Jacovella, Ugo, Gans, Bérenger, Bozek, John D., Holland, David M. P.

المصدر: Journal of Chemical Physics; 2/21/2024, Vol. 160 Issue 7, p1-13, 13p

مصطلحات موضوعية: AUGER effect, PHOTOELECTRONS, FRONTIER orbitals, RYDBERG states, PHOTOELECTRON spectra, AUGERS, IONS

المؤلفون: Bai, Jingxu, Jiao, Yuechun, Song, Rong, Li, Zhenhua, Zhao, Jianming, Jia, Suotang

المصدر: Journal of Chemical Physics; 11/21/2023, Vol. 159 Issue 19, p1-6, 6p

مصطلحات موضوعية: PHOTOIONIZATION, MICROCHANNEL plates, RYDBERG states, POLAR molecules, REACTIVE oxygen species, QUANTUM numbers, MOLECULES, AUGER effect, CESIUM

المؤلفون: Asano, Natsuko, Matsumoto, Takahiro, Okano, Yasuyuki, Onodera, Hiroshi, Asahina, Shunsuke

المصدر: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-5 Jul, 2023

Relation: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Zhu, Xintong, Roslan, Amirul Afiq Hamizan M, Xie, Jun, Ong, Kian Kok, Yip, Kim Hong, Nistala, Ramesh Rao, Mo, Zhi Qiang

المصدر: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-5 Jul, 2023

Relation: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Hua, Younan, Liao, Lois, Zhu, Lei, Zhao, Yanfei, Xiaodan, Luo, Liu, Yuanyuan, Zhang, Linhua, Li, Xiaomin

المصدر: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-4 Jul, 2023

Relation: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Borghei, Moein, Velazquez, Daniel, McMullen, Robert, Latchford, George, Riordan, Brian, Langtry, Robin

المصدر: 2023 30th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV) Discharges and Electrical Insulation in Vacuum (ISDEIV), 2023 30th International Symposium on. :74-77 Jun, 2023

Relation: 2023 30th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)

المؤلفون: Wai, Wan Tatt

المصدر: 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2023 34th Annual. :1-5 May, 2023

Relation: 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)