المؤلفون: Wu, Mei-Ling, Wong, Wei-Jhih

المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :1134-1138 Jul, 2020

Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Sun, B., Qin, F., Sun, J., Chen, P., An, T.

المصدر: 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2017 18th International Conference on. :894-897 Aug, 2017

Relation: 2017 18th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Chen, Pei, Pan, Tian, Sun, Jinglong, Qin, Fei

المصدر: 2016 17th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2016 17th International Conference on. :1075-1078 Aug, 2016

Relation: 2016 17th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Li, Zhaoqiang, Jing, Xiangmeng, Jiang, Feng, Zhang, Wenqi

المصدر: 2014 15th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2014 15th International Conference on. :874-877 May, 2014

Relation: 2014 15th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Ng, K. K., Sin, C. K.

المصدر: Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the. :107-111 Jul, 2013

Relation: 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Yuanhang Liu, Hongfei Tao, Dewen Zhao, Xinchun Lu

المصدر: Materials, Vol 15, Iss 12, p 4230 (2022)

مصطلحات موضوعية: total thickness variation, backside grinding, grinding tool configuration, angle adjustment, ultra-precision grinding, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/15/12/4230; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/ecc13acd16df4d199dc7f012d6c9e6f6

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