يعرض 1 - 10 نتائج من 1,061 نتيجة بحث عن '"baseplate"', وقت الاستعلام: 0.96s تنقيح النتائج
  1. 1
    مؤتمر
    Design and Simulation Study of a Novel Diamond Based Composite Heat Dissipation Baseplate

    المؤلفون: Tang, Honghao, Wang, Jianpeng, Zheng, Rongting, Cao, Jing, Wei, Junsheng, Zhu, Guodong

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  2. 2
    مؤتمر
    A Novel Substrate-Baseplate Structure for Medium Voltage SiC MOSFET Device

    المؤلفون: Ma, Dingkun, Xiao, Guochun, Li, Lei, Yuan, Tianshu, Sun, Peiyuan, Guo, Jiacheng, Gao, Kai, Wang, Laili

    المصدر: 2024 IEEE 7th International Electrical and Energy Conference (CIEEC) Electrical and Energy Conference (CIEEC), 2024 IEEE 7th International. :2958-2965 May, 2024

    Relation: 2024 IEEE 7th International Electrical and Energy Conference (CIEEC）

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  3. 3
    مؤتمر
    Analysis and Cancellation of Common-Mode Voltage in the Buck Converter

    المؤلفون: Helton, Jared C., Lemmon, Andrew N., Brovont, Aaron D.

    المصدر: 2023 IEEE Electric Ship Technologies Symposium (ESTS) Electric Ship Technologies Symposium (ESTS), 2023 IEEE. :505-511 Aug, 2023

    Relation: 2023 IEEE Electric Ship Technologies Symposium (ESTS)

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  4. 4
    مؤتمر
    A Simple and Non-Destructive Method to Measure Per-Terminal Baseplate Coupling of Power Modules

    المؤلفون: DeBoi, Brian, Curbow, Austin, Lemmon, Andrew

    المصدر: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC) Applied Power Electronics Conference and Exposition (APEC), 2023 IEEE. :1633-1638 Mar, 2023

    Relation: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC)

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  5. 5
    دورية أكاديمية
    Exploring Influential Factors Affecting Baseplate Distortion and Residual Stress in Insulated-Gate Bipolar Transistor (IGBT) Modules During Reflow Soldering

    المؤلفون: Gao, ShangAff1, IDs11664024113410_cor1, Teng, Chunzhuang, Wang, Haoxiang, Li, Honggang, Kang, Renke

    المصدر: Journal of Electronic Materials. 53(10):6432-6447

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  6. 6
    دورية أكاديمية
    Comprehensive Analysis of Filter Inductor Topology on Common-Mode Conducted Emissions for the Boost Converter

    المؤلفون: Helton, J.C., Lemmon, A.N., Brovont, A.D.

    المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 38(4):4647-4657 Apr, 2023

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  7. 7
    مؤتمر
    Single Side Direct Cooling SiC Module Baseplate Warpage Behavior and Solutions

    المؤلفون: Concepcion, Raymund Nonato, Rodriguez, Jenelyn

    المصدر: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) Electronics Manufacturing Technology Conference (IEMT), 2022 IEEE 39th International. :1-5 Oct, 2022

    Relation: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)

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  8. 8
    دورية أكاديمية
    Distal clavicle autograft for large glenoid defects during revision reverse total shoulder arthroplasty

    المؤلفون: Jordan A. Bauer, MD, Bradley Hawayek, MD, Gabrielle Hartman, BS, Lin Feng, MA, Thomas R. Duquin, MD

    المصدر: JSES Reviews, Reports, and Techniques, Vol 4, Iss 3, Pp 449-456 (2024)

    مصطلحات موضوعية: Reverse total shoulder arthroplasty, Revision, Distal clavicle autograft, Augmented baseplate, Glenoid bone loss, Glenosphere, Surgery, RD1-811

    وصف الملف: electronic resource

    Relation: http://www.sciencedirect.com/science/article/pii/S2666639124000427; https://doaj.org/toc/2666-6391

    URL الوصول: https://doaj.org/article/8edaafbe43184b71854e58dc8d693d0c

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  9. 9
    مؤتمر
    A Novel Technique for the Suppression of the Displacement Current Through Power Module Base-Plate Capacitance

    المؤلفون: Saeidi, Mahmoud, Nazeri, Ahmad Ali, Zilic, Rufad, Zacharias, Peter

    المصدر: 2022 24th European Conference on Power Electronics and Applications (EPE'22 ECCE Europe) Power Electronics and Applications (EPE'22 ECCE Europe), 2022 24th European Conference on. :01-07 Sep, 2022

    Relation: 2022 24th European Conference on Power Electronics and Applications (EPE’22 ECCE Europe)

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  10. 10
    مؤتمر
    Forward design research on the warpage of baseplate for IGBT module

    المؤلفون: Chang, Guiqin, Fang, Chao, Tang, Xiang, Luo, Haihui, Shi, Tingchang, Yu, Jun

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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