المؤلفون: Weitao, Zhu, Haibing, Zhang, Xiaole, Kuang, Dehong, Mei

المصدر: 2015 16th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2015 16th International Conference on. :681-684 Aug, 2015

Relation: 2015 16th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Zain, Syed Mohamad Mardzukey Syed Mohamed^Aff26, Ani, Fakhrozi Che^Aff26, Ramli, Mohamad Riduwan^Aff26, Jalar, Azman^{Aff27, Aff28}, Bakar, Maria Abu^Aff27

المساهمون: Kacprzyk, Janusz, Series Editor^Aff1, Pal, Nikhil R., Advisory Editor^Aff2, Bello Perez, Rafael, Advisory Editor^Aff3, Corchado, Emilio S., Advisory Editor^Aff4, Hagras, Hani, Advisory Editor^Aff5, Kóczy, László T., Advisory Editor^Aff6, Kreinovich, Vladik, Advisory Editor^Aff7, Lin, Chin-Teng, Advisory Editor^Aff8, Lu, Jie, Advisory Editor^Aff9, Melin, Patricia, Advisory Editor^Aff10, Nedjah, Nadia, Advisory Editor^Aff11, Nguyen, Ngoc Thanh, Advisory Editor^Aff12, Wang, Jun, Advisory Editor^Aff13, Mat Jizat, Jessnor Arif, editor^Aff14, Khairuddin, Ismail Mohd, editor^Aff15, Mohd Razman, Mohd Azraai, editor^Aff16, Ab. Nasir, Ahmad Fakhri, editor^Aff17, Abdul Karim, Mohamad Shaiful, editor^Aff18, Jaafar, Abdul Aziz, editor^Aff19, Hong, Lim Wei, editor^Aff20, Abdul Majeed, Anwar P. P., editor^Aff21, Liu, Pengcheng, editor^Aff22, Myung, Hyun, editor^Aff23, Choi, Han-Lim, editor^Aff24, Susto, Gian-Antonio, editor^Aff25

المصدر: Advances in Robotics, Automation and Data Analytics : Selected Papers from iCITES 2020. 1350:309-314

المؤلفون: S. M. M. S. M. Zain, A. Jalar, M. Abu Bakar, F. Che Ani, M. R. Ramli

المصدر: Informacije MIDEM, Vol 51, Iss 4, Pp 261-266 (2021)

مصطلحات موضوعية: bga component, epoxy mold compound, horizontal crack, moisture crack, moisture sensitivity level 3, vertical crack, Electronics, TK7800-8360

وصف الملف: electronic resource

Relation: http://www.midem-drustvo.si/Journal%20papers/MIDEM_51(2021)4p261.pdf; https://doaj.org/toc/0352-9045; https://doaj.org/toc/2232-6979

URL الوصول: https://doaj.org/article/8b0fe4a9200c4c078454bb86532ff9de

المؤلفون: Robson Marques-Costa, Antonio da Silva-Vieira, Raimundo Valdan Pereira-Lopes, Jandecy Cabral-Leite, Roberto Tetsuo-Fujiyama

المصدر: Revista Facultad de Ingeniería Universidad de Antioquia, Iss 78 (2016)

مصطلحات موضوعية: Reflow soldering, BGA component, cross section, cracks, voids, quality in the process, Engineering (General). Civil engineering (General), TA1-2040

وصف الملف: electronic resource

Relation: https://revistas.udea.edu.co/index.php/ingenieria/article/view/19768; https://doaj.org/toc/0120-6230; https://doaj.org/toc/2422-2844

URL الوصول: https://doaj.org/article/688cf5fd89da4143832fb7c56417444a

المؤلفون: Robson Marques Costa

المصدر: ITEGAM-JETIA, Vol 1, Iss 1 (2015)

مصطلحات موضوعية: Quality in process, Reflow soldering, BGA component, Cross section, Cracks and Voids, Technology, Technology (General), T1-995, Science (General), Q1-390

وصف الملف: electronic resource

Relation: https://itegam-jetia.org/journal/index.php/jetia/article/view/7; https://doaj.org/toc/2447-0228

URL الوصول: https://doaj.org/article/571be6b9bce4437ba692e04e0e210373

المؤلفون: S. A. Sorokin, O. Yu. Sysoev

المصدر: Радиопромышленность, Vol 28, Iss 4, Pp 35-40 (2018)

مصطلحات موضوعية: TK7800-8360, Computer science, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Decoupling capacitor, Microbiology, law.invention, Printed circuit board, law, Ball grid array, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Equipotential, two-port elements placement, decoupling capacitor, business.industry, printed circuit board, Electrical engineering, 020206 networking & telecommunications, Chip, Capacitor, bga component, visual_art, Electronic component, visual_art.visual_art_medium, Electronics, Routing (electronic design automation), business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::11141e748dc018f8fd8ca48b3af82c26
https://doi.org/10.21778/2413-9599-2018-28-4-35-40

المؤلفون: A. O. Ustinov

المصدر: Радиопромышленность, Vol 28, Iss 4, Pp 52-58 (2018)

مصطلحات موضوعية: CMOS sensor, detector, TK7800-8360, cmos sensor, business.industry, Computer science, Detector, Electrical engineering, non-destructive testing, x-ray control, Microbiology, Dot pitch, Flat panel detector, soldering quality, x-ray, bga component, Nondestructive testing, visual_art, Electronic component, visual_art.visual_art_medium, Microelectronics, Electronics, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c575e2e43b2be3004a5cb0088c35f2a0
https://doi.org/10.21778/2413-9599-2018-28-4-52-58

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المؤلفون: Kurapov, S. V., Chechenja, V. S.

المصدر: Radio Electronics, Computer Science, Control; № 3 (2016): Radio Electronics, Computer Science, Control
Радиоэлектроника, информатика, управление; № 3 (2016): Радиоэлектроника, информатика, управление
Радіоелектроніка, iнформатика, управління; № 3 (2016): Радіоелектроніка, інформатика, управління

مصطلحات موضوعية: BGA component, layout, drawing, discrete, sequence, channel, BGA компонент, схема, рисунок, макродискрет, кортеж, множество, канал

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=scientific_p::11e76c0c442cb1ee77f54c30d9b5070c
http://ric.zntu.edu.ua/article/view/80905

المؤلفون: Marques-Costa, Robson, da Silva-Vieira, Antonio, Valdan Pereira-Lopes, Raimundo, Cabral-Leite, Jandecy, Tetsuo-Fujiyama, Roberto

المصدر: Revista Facultad de Ingeniería Universidad de Antioquia, Issue: 78, Pages: 55-61, Published: MAR 2016

مصطلحات موضوعية: componente BGA, cross section, grietas, voids, Calidad del proceso, Reflow soldering, soldadura Reflow, vacíos, BGA component, cracks, Quality in the process

وصف الملف: text/html

URL الوصول: https://explore.openaire.eu/search/publication?articleId=od_______618::e80d269bf72df1daa38efdacfe6375a7
http://www.scielo.org.co/scielo.php?script=sci_arttext&pid=S0120-62302016000100007&lng=en&tlng=en