المؤلفون: Arias, Andrea, Rowell, Petra, Urteaga, Miguel, Griffith, Zach, Shinohara, Keisuke, Bergman, Josh, Carter, Andy, Pierson, Richard, Brar, Bobby, Buckwalter, James, Rodwell, Mark

المصدر: 2019 IEEE MTT-S International Microwave Symposium (IMS) Microwave Symposium (IMS), 2019 IEEE MTT-S International. :1303-1305 Jun, 2019

Relation: 2019 IEEE/MTT-S International Microwave Symposium - IMS 2019

المؤلفون: Bernard Jarry, Rachid Hamani, Mien Lintignat, Cristian Andrei

المساهمون: Systèmes RF (XLIM-SRF), XLIM (XLIM), Université de Limoges (UNILIM)-Centre National de la Recherche Scientifique (CNRS)-Université de Limoges (UNILIM)-Centre National de la Recherche Scientifique (CNRS), NXP Semiconductors

المصدر: ICECS
Electronics, Circuits and Systems (ICECS), 2014 21st IEEE International Conference on
Electronics, Circuits and Systems (ICECS), 2014 21st IEEE International Conference on, 2014, Unknown, Unknown Region. pp.351-354, ⟨10.1109/ICECS.2014.7049994⟩

مصطلحات موضوعية: Integrated circuit interconnections, Engineering, Circuit design, output impedance, Impedance matching, 02 engineering and technology, Integrated circuit design, low noise amplifiers, BiCMOS, Transistors, Noise figure, frequency 24 GHz, Low noise amplifier, integrated circuit design, NXP semiconductors, Microwave band, Frequency measurement, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Inductors, Output impedance, S-parameters, size 0.25 mum, ComputingMilieux_MISCELLANEOUS, amplifier circuit demonstrator, Semiconductor device measurement, business.industry, Amplifier, matching networks, 020208 electrical & electronic engineering, Electrical engineering, BiCMOS analogue integrated circuits, 020206 networking & telecommunications, Low-noise amplifier, performance evaluation, [SPI.TRON]Engineering Sciences [physics]/Electronics, LNA circuit design, interconnect line parasitics, Integrated circuit modeling, bipolar MMIC, circuit simulation, Octagonal inductors, input impedance, BiCMOS mature technology, business, schematic circuit simulations, Interconnect lines

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d4583095bcf9ca657bcbca1bd42590bc
https://doi.org/10.1109/icecs.2014.7049994

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