المؤلفون: Lai, Yangyang, X, Jiefeng, Ha, Jonghwan, Deo, Karthik A, Yang, Junbo, Park, Seungbae

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1538-1542 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Chee, Choong Kooi, Hsu, Sean, Patel, Janak, Bamido, Alaba

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :929-934 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Neumann, Taylor V., Spielman, Vaughn, Hopkins, Michael A., Wallans, Michael, Ronay, Mark

المصدر: 2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2023 39th. :1-4 Mar, 2023

Relation: 2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

المؤلفون: Yeo, S.M., Yow, H., Yeoh, K.H., Ishak, S.H.b.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(8):1410-1420 Aug, 2022

المؤلفون: Guo, S., Huang, Y., Chen, D., Ren, L., Wang, D., Feng, W.

المصدر: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 71:1-10 2022

المؤلفون: Shia, David, Yang, Jin

المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :158-165 Jul, 2020

Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Ruifen, Zhang, Nantes, Donald, Lingling, Teo

المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :543-547 Dec, 2019

Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

المؤلفون: Richter, Jessica, Steenmann, Anna, Schellscheidt, Benjamin, Licht, Thomas, Madler, Ralph

المصدر: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-6 Sep, 2019

Relation: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Sourav Banerjee, Vahid Tavaf, Mustahseen M. Indaleeb

المصدر: Journal of Composites Science, Vol 8, Iss 3, p 107 (2024)

مصطلحات موضوعية: adhesive bonding, NDE, nondestructive evaluation, ultrasonic NDE, bond line NDE, composite bond, Technology, Science

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2504-477X/8/3/107; https://doaj.org/toc/2504-477X

URL الوصول: https://doaj.org/article/eff5aad463bf4f73bfe241c3e6c9ecfc

المؤلفون: Hurina, Larysa, Vyshnepolskyi, Yevhen, Pavlenko, Dmytro, Stepanov, Dmytro

المصدر: 2020 IEEE 10th International Conference Nanomaterials: Applications & Properties (NAP) Nanomaterials: Applications & Properties (NAP), 2020 IEEE 10th International Conference. :02SAMA07-1-02SAMA07-5 Nov, 2020

Relation: 2020 IEEE 10th International Conference Nanomaterials: Applications & Properties (NAP)