المؤلفون: Hellemans, T., Kielanski, G., Van Houdt, B.

المصدر: IEEE/ACM Transactions on Networking IEEE/ACM Trans. Networking Networking, IEEE/ACM Transactions on. 31(4):1626-1641 Aug, 2023

المؤلفون: Xing, Yiwen, Deng, Jinzhou, Lu, Yue, Zhong, Sheng, Zhang, Dongjiu, Wang, Honglun

المصدر: 2022 2nd International Conference on Big Data, Artificial Intelligence and Risk Management (ICBAR) ICBAR Big Data, Artificial Intelligence and Risk Management (ICBAR), 2022 2nd International Conference on. :86-91 Nov, 2022

Relation: 2022 2nd International Conference on Big Data, Artificial Intelligence and Risk Management (ICBAR)

المؤلفون: Dopson, Matt^{Aff1, IDs0028502402120w_cor1}, Emary, Clive

المصدر: Journal of Mathematical Biology. 89(2)

المؤلفون: Li, Wei, Wei, Tao, Wang, Jun, Chu, Xiuqin, Wang, Yanling

المصدر: 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) Electromagnetic Compatibility (APEMC), 2022 Asia-Pacific International Symposium on. :279-281 Sep, 2022

Relation: 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)

المؤلفون: Lee, Ken, Kim, Min Sung, Lee, Jong Tae, Jeon, Dong Ju, Jang, Eun Ju, Lee, Kyu Jin

المصدر: 2019 China Semiconductor Technology International Conference (CSTIC) China Semiconductor Technology International Conference (CSTIC), 2019. :1-5 Mar, 2019

Relation: 2019 China Semiconductor Technology International Conference (CSTIC)

المؤلفون: Barbier, J., Chan, C.L., Macris, N.

المصدر: IEEE Transactions on Information Theory IEEE Trans. Inform. Theory Information Theory, IEEE Transactions on. 67(4):2093-2114 Apr, 2021

المؤلفون: Sheng, Nan, Xiong, Weihua, Hao, Shaojie, Wang, Shujian

المصدر: 2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT) Microwave and Millimeter Wave Technology (ICMMT), 2020 International Conference on. :1-3 Sep, 2020

Relation: 2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT)

المؤلفون: Zhou, Jianwen^{Aff1, Aff2}, Zhou, Hai-Jun^{Aff1, Aff2, Aff3, IDs10955023032107_cor2}

المصدر: Journal of Statistical Physics. 190(12)

المؤلفون: Jin, S., Liu, D., Wang, Y., Chen, B., Fan, J.

المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 60(5):1481-1490 Oct, 2018

المؤلفون: Krzysztof Jasiński, Lech Murawski, Marcin Kluczyk, Adam Muc, Adam Szeleziński, Tomasz Muchowski, Marek Chodnicki

المصدر: Advances in Sciences and Technology, Vol 17, Iss 1, Pp 274-289 (2023)

مصطلحات موضوعية: modal analysis, cavity method, additive method, machine element repair, Engineering (General). Civil engineering (General), TA1-2040

وصف الملف: electronic resource

Relation: http://www.astrj.com/Selected-Aspects-of-3D-Printing-for-Emergency-Replacement-of-Structural-Elements,158486,0,2.html; https://doaj.org/toc/2080-4075; https://doaj.org/toc/2299-8624

URL الوصول: https://doaj.org/article/651dcb7f01dd42f5aaf2ca1d6618ab28