المؤلفون: Ozguc, Serdar, Wang, Qingyang, Narayanan, Akshith, Bonner, Richard W.

المصدر: 2024 40th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2024 40th. :1-6 Mar, 2024

Relation: 2024 40th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

المؤلفون: van Erp, R., Perera, N., Nela, L., Osama Elhagali, I., Zhu, H., Matioli, E.

المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 39(8):9717-9723 Aug, 2024

المؤلفون: Miyazawa, Risa, Mori, Hiroyuki, Jain, Aakrati, Farooq, Mukta, Hisada, Takashi

المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-8 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Qian, Qian, Zhang, Xin, Tian, Shurong, Weibel, Justin A., Pan, Liang

المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-7 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Oukaira, Aziz, Said, Dhaou, Zbitou, Jamal, Lakhssassi, Ahmed

المصدر: 2023 17th International Conference on Ubiquitous Information Management and Communication (IMCOM) Ubiquitous Information Management and Communication (IMCOM), 2023 17th International Conference on. :1-5 Jan, 2023

Relation: 2023 17th International Conference on Ubiquitous Information Management and Communication (IMCOM)

المؤلفون: Samal, Sangram Kumar^Aff14, Saha, Sandip Kumar^Aff14

المساهمون: Chaari, Fakher, Series Editor^Aff1, Gherardini, Francesco, Series Editor^Aff2, Ivanov, Vitalii, Series Editor^Aff3, Haddar, Mohamed, Series Editor^Aff4, Cavas-Martínez, Francisco, Editorial Board Member^Aff5, di Mare, Francesca, Editorial Board Member^Aff6, Kwon, Young W., Editorial Board Member^Aff7, Trojanowska, Justyna, Editorial Board Member^Aff8, Xu, Jinyang, Editorial Board Member^Aff9, Singh, Krishna Mohan, editor^Aff10, Dutta, Sushanta, editor^Aff11, Subudhi, Sudhakar, editor^Aff12, Singh, Nikhil Kumar, editor^Aff13

المصدر: Fluid Mechanics and Fluid Power, Volume 4 : Select Proceedings of FMFP 2022. :319-331

المؤلفون: Wei, Tao, Huang, Haojie, Ma, Yupa, Qian, Jiyu

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Shameem, Syed, Manjula, T., Prakeerth, Kedarasipalli, Revanth, Kollipara, Balaji, Chintakayala Naga Sai

المصدر: 2021 International Conference on Simulation, Automation & Smart Manufacturing (SASM) Simulation, Automation & Smart Manufacturing (SASM), 2021 International Conference on. :1-6 Aug, 2021

Relation: 2021 International Conference on Simulation, Automation & Smart Manufacturing (SASM)

المؤلفون: Yongjia Wu, Peng Zhang, Sen Chen, Congcong Zhi, Tianhao Shi, Tingrui Gong, Tingzhen Ming

المصدر: Case Studies in Thermal Engineering, Vol 58, Iss , Pp 104350- (2024)

مصطلحات موضوعية: Thermoelectric cooler, Transient cooling, Temperature control, Power chip cooling, Engineering (General). Civil engineering (General), TA1-2040

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2214157X24003812; https://doaj.org/toc/2214-157X

URL الوصول: https://doaj.org/article/e9c9b66e09364c58b30b811b9342ce23

المؤلفون: Bar-Cohen, A., Asheghi, M., Chainer, T.J., Garimella, S.V., Goodson, K., Gorle, C., Mandel, R., Maurer, J.J., Ohadi, M., Palko, J.W., Parida, P.R., Peles, Y., Plawsky, J.L., Schultz, M.D., Weibel, J.A., Joshi, Y.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(10):1546-1564 Oct, 2021