المؤلفون: Kohno, Kazuto, Kanao, Sho, Iokibe, Kengo, Toyota, Yoshitaka

المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :70-73 May, 2024

Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)

المؤلفون: Yu, H., Cai, M., Liu, Y., Lu, F.

المصدر: IEEE Transactions on Pattern Analysis and Machine Intelligence IEEE Trans. Pattern Anal. Mach. Intell. Pattern Analysis and Machine Intelligence, IEEE Transactions on. 45(6):6631-6646 Jun, 2023

المؤلفون: Sun, M., Liao, X.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(6):3335-3340 Jun, 2023

المؤلفون: Kaloudi, N., Li, J.

المصدر: IEEE Transactions on Information Forensics and Security IEEE Trans.Inform.Forensic Secur. Information Forensics and Security, IEEE Transactions on. 18:5567-5579 2023

المؤلفون: Xia, Zhixin, Luo, Yunlong, Qi, Yihong, Fan, Jun, Ye, Xiaoning

المصدر: 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) Electromagnetic Compatibility (APEMC), 2022 Asia-Pacific International Symposium on. :627-629 Sep, 2022

Relation: 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)

المؤلفون: Wu, X., Cao, M., Shan, G., Yang, Y.

المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 41(8):2372-2379 Aug, 2022

المؤلفون: Gallina, B., Montecchi, L., de Oliveira, A.L., Bressan, L.

المصدر: IEEE Software IEEE Softw. Software, IEEE. 39(4):39-47 Aug, 2022

المؤلفون: Kim, Hyunwoo, Kim, Jeongwon, Ahn, Jungho, Ju, Lee

المصدر: 2022 IEEE 20th Biennial Conference on Electromagnetic Field Computation (CEFC) Electromagnetic Field Computation (CEFC), 2022 IEEE 20th Biennial Conference on. :1-2 Oct, 2022

Relation: 2022 IEEE 20th Biennial Conference on Electromagnetic Field Computation (CEFC)

المؤلفون: Hegde, Shashank, Sethumurugan, Subhash, Cherupalli, Hari, Duwe, Henry, Sartori, John

المصدر: 2021 26th Asia and South Pacific Design Automation Conference (ASP-DAC) Design Automation Conference (ASP-DAC), 2021 26th Asia and South Pacific. :318-324 Jan, 2021

Relation: 2021 26th Asia and South Pacific Design Automation Conference (ASP-DAC)

المؤلفون: Pathania, Sunil, Vasa, Mallikarjun, Shrivastava, Ashish, Kumar, Sanjay, Kumar, Vijender, Muthusamy, Sukumar, Seema, P K, Mutnury, Bhyrav, Sharma, Rohit

المصدر: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) Electrical Design of Advanced Packaging and Systems (EDAPS), 2019. :1-3 Dec, 2019

Relation: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS)