المؤلفون: Siqi Quan, Guoyou Gan, Xiang lei Yu, Xian jie Tang, Hu Sun, Zhuo Qian, Junpeng Li

المصدر: Materials Research Express, Vol 11, Iss 5, p 055002 (2024)

مصطلحات موضوعية: conductive silver paste, low temperature curing, Ag NPs sintering, volume resistivity, Materials of engineering and construction. Mechanics of materials, TA401-492, Chemical technology, TP1-1185

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2053-1591

URL الوصول: https://doaj.org/article/e093625c0f094cc0b76c5ddc9eac0b93

المؤلفون: Chen, Yuanming, He, Wei, Zhou, Guoyun, He, Xuemei, Zhou, Hua, Mo, Yunqi, He, Bo

المصدر: 2010 International Conference on Anti-Counterfeiting, Security and Identification Anti-Counterfeiting Security and Identification in Communication (ASID), 2010 International Conference on. :277-280 Jul, 2010

Relation: 2010 International Conference on Anti-Counterfeiting, Security and Identification (2010 ASID)

المؤلفون: He, Xia^Aff1, Liu, Qingchun, Zhou, Ying, Chen, Zhan, Zhu, Chenlu, Jin, Wanhui

المصدر: Frontiers of Materials Science. 15(3):406-415

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المؤلفون: Yaoli Huang, Cong Zheng, Jinhua Jiang, Huiqi Shao, Nanliang Chen

المصدر: Polymers, Vol 15, Iss 6, p 1585 (2023)

مصطلحات موضوعية: reconfigurable antenna, bi-stable substrate, radiation pattern, carbon nanotube film (CNTF), conductive silver paste (CSP), Organic chemistry, QD241-441

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2073-4360/15/6/1585; https://doaj.org/toc/2073-4360

URL الوصول: https://doaj.org/article/07657bbbb0ad455195e14ddddd786f7a

المؤلفون: Liu, J., Cao, Y., Wang, X., Duan, J., Zeng, X.

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 33(4):899-903 Nov, 2010

المؤلفون: Youliang Cheng, Jin Zhang, Changqing Fang, Wenke Qiu, Hao Chen, Haonan Liu, Ying Wei

المصدر: Molecules, Vol 27, Iss 22, p 8030 (2022)

مصطلحات موضوعية: conductive silver paste, Ag microflakes, Ag nanoparticles, Ag nanowires, ternary fillers, Organic chemistry, QD241-441

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1420-3049/27/22/8030; https://doaj.org/toc/1420-3049

URL الوصول: https://doaj.org/article/d98f8c234b674dc5ae340690c2c14b92

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المؤلفون: Longzhu Cai, Qiushi Yu

المصدر: Materials, Vol 14, Iss 23, p 7283 (2021)

مصطلحات موضوعية: glass antenna, transparent antenna, conductive copper foil (CCF), conductive silver paste (CSP), indium tin oxide (ITO), Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/14/23/7283; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/1316b9d34d74436d8012bdaf2bb4f132

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