يعرض 1 - 10 نتائج من 545 نتيجة بحث عن '"constraint effect"', وقت الاستعلام: 0.90s تنقيح النتائج
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    دورية أكاديمية

    المؤلفون: Zhang, Yuntai, Jiang, LizhongAff1, Aff2, Zhou, WangbaoAff1, IDs10518023018451_cor3, Wu, Lingxu, Zhao, Yinting, Lai, Zhipeng

    المصدر: Bulletin of Earthquake Engineering: Official Publication of the European Association for Earthquake Engineering. 22(5):2739-2768

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    كتاب إلكتروني

    المؤلفون: Wei, BiaoAff20, Aff22, Yuan, ShuaijieAff21, Aff22, Jiang, LizhongAff20, Aff22, Yu, YujieAff20, Aff22

    المساهمون: Zheng, Zheng, Editor-in-ChiefAff1, Xi, Zhiyu, Associate EditorAff2, Gong, Siqian, Series EditorAff3, Hong, Wei-Chiang, Series EditorAff4, Mellal, Mohamed Arezki, Series EditorAff5, Narayanan, Ramadas, Series EditorAff6, Nguyen, Quang Ngoc, Series EditorAff7, Ong, Hwai Chyuan, Series EditorAff8, Sun, Zaicheng, Series EditorAff9, Ullah, Sharif, Series EditorAff10, Wu, Junwei, Series EditorAff11, Zhang, Baochang, Series EditorAff12, Zhang, Wei, Series EditorAff13, Zhu, Quanxin, Series EditorAff14, Zheng, Wei, Series EditorAff15, Liu, Peng, editorAff16, Bilgin, Hüseyin, editorAff17, Yang, Jialing, editorAff18, Hu, Bin, editorAff19

    المصدر: Proceedings of the 2024 5th International Conference on Civil, Architecture and Disaster Prevention and Control (CADPC 2024). 31:206-216

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    دورية أكاديمية

    المؤلفون: Jiang, LizhongAff1, Aff2, Zhong, Bufan, Zhou, WangbaoAff1, Aff2, IDs1051802301839z_cor3, Zhang, Yuntai, Yu, Jian, Zhao, Yinting

    المصدر: Bulletin of Earthquake Engineering: Official Publication of the European Association for Earthquake Engineering. :1-27

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    دورية أكاديمية
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    مؤتمر

    المصدر: 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018 17th IEEE Intersociety Conference on. :1309-1313 May, 2018

    Relation: 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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    دورية أكاديمية
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    مؤتمر

    المؤلفون: Tian, Lanlan, Liu, Jun, Ge, Weimin

    المصدر: 2017 IEEE International Conference on Mechatronics and Automation (ICMA) Mechatronics and Automation (ICMA), 2017 IEEE International Conference on. :781-786 Aug, 2017

    Relation: 2017 IEEE International Conference on Mechatronics and Automation (ICMA)

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