المؤلفون: Maubert, Marie, Gottardi, Mathilde, Philip, Pierre-Emile, Fragnaud, Emilie, Romero, Gilles, Cornelis, Arnaud, Hijazi, Hadi, Fournel, Frank, Calvo-Munoz, Maria-Luisa

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :631-636 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Puthoor, Anila, Agrawal, Megha, M, Varshini K, Rao, Koushik K

المصدر: 2023 16th International Conference on Sensing Technology (ICST) Sensing Technology (ICST), 2023 16th International Conference on. :1-5 Dec, 2023

Relation: 2023 16th International Conference on Sensing Technology (ICST)

المؤلفون: Lopez-Villegas, J. M., Vidal, N.

المصدر: 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023 Microwave Symposium - IMS 2023, 2023 IEEE/MTT-S International. :641-644 Jun, 2023

Relation: 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023

المؤلفون: Kim, Mingi, Bae, Jong Hyuk, Bai, Seoung Jai^{Aff1, IDs1254102401056x_cor3}

المصدر: International Journal of Precision Engineering and Manufacturing. :1-11

المؤلفون: Li, Xiao, Lei, Zhi-Gang, Li, Zhe, Gao, Li-Yin, Jia, Zhao-Wei, Liu, Zhi-Quan, Sun, Rong

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Rozsas, Gabor, Bognar, Gyorgy, Takacs, Gabor, Plesz, Balazs

المصدر: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2022 Symposium on. :1-5 Jul, 2022

Relation: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Su, Renay, Yu, Joseph, Wei, Steven

المصدر: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2021 16th International. :160-163 Dec, 2021

Relation: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Dong, Yi, Li, Zhe, Gao, Li-Ying, Li, Xiao, Liu, Zhi-Quan, Sun, Rong

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-6 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Lopez-Villegas, J.M., Vidal, N., Barenys, A.S.

المصدر: IEEE Access Access, IEEE. 10:63375-63382 2022

المؤلفون: Cheng, K.^{Aff1, IDs11340023009916_cor1}, Ono, Y., Izumi, C., Yamamoto, Y., Morito, S.

المصدر: Experimental Mechanics: An International Journal Integrating Experimental Methods with the Mechanical Behavior of Materials and Structures. 63(8):1309-1320