يعرض 1 - 10 نتائج من 51 نتيجة بحث عن '"copper filling"', وقت الاستعلام: 0.98s تنقيح النتائج
  1. 1
    مؤتمر

    المصدر: 2018 8th International Electric Drives Production Conference (EDPC) Electric Drives Production Conference (EDPC), 2018 8th International. :1-6 Dec, 2018

    Relation: 2018 8th International Electric Drives Production Conference (EDPC)

  2. 2
    دورية أكاديمية

    المؤلفون: Li, C., Zou, J., Liu, S., Zheng, H., Fei, P.

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(3):391-398 Mar, 2019

  3. 3
    كتاب إلكتروني

    المؤلفون: Riedel, AndreasAff7, Kneidl, M.Aff7, Seefried, J.Aff7, Kuehl, A.Aff7, Franke, J.Aff7

    المساهمون: Behrens, Bernd-Arno, editorAff1, Brosius, Alexander, editorAff2, Drossel, Welf-Guntram, editorAff3, Hintze, Wolfgang, editorAff4, Ihlenfeldt, Steffen, editorAff5, Nyhuis, Peter, editorAff6

    المصدر: Production at the Leading Edge of Technology : Proceedings of the 11th Congress of the German Academic Association for Production Technology (WGP), Dresden, September 2021. :395-402

  4. 4
    مؤتمر

    المصدر: 2015 16th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2015 16th International Conference on. :153-157 Aug, 2015

    Relation: 2015 16th International Conference on Electronic Packaging Technology (ICEPT)

  5. 5
    مؤتمر

    المؤلفون: Mo, X., Zhang, J., Li, M.

    المصدر: 2015 16th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2015 16th International Conference on. :210-213 Aug, 2015

    Relation: 2015 16th International Conference on Electronic Packaging Technology (ICEPT)

  6. 6
    مؤتمر

    المصدر: 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on. :291-294 Jun, 2015

    Relation: TRANSDUCERS 2015 - 2015 18th International Solid-State Sensors, Actuators and Microsystems Conference

  7. 7
    مؤتمر

    المصدر: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International. :119-122 May, 2015

    Relation: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

  8. 8
    مؤتمر

    المصدر: 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :356-359 Aug, 2013

    Relation: 2013 14th International Conference on Electronic Packaging Technology (ICEPT)

  9. 9
    مؤتمر

    المؤلفون: Liu, Yongfu, Wu, Daowei

    المصدر: 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :1271-1275 Aug, 2013

    Relation: 2013 14th International Conference on Electronic Packaging Technology (ICEPT)

  10. 10
    دورية أكاديمية

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