المؤلفون: Das, Arup Kumar, Guvvala, Nagaraju, Pamidi, Sastry, Cheetham, Peter

المصدر: 2024 IEEE Electrical Insulation Conference (EIC) Electrical Insulation Conference (EIC), 2024 IEEE. :456-459 Jun, 2024

Relation: 2024 IEEE Electrical Insulation Conference (EIC)

المؤلفون: Berlingard, Q., Moulin, M., Michel, J.-P., Fache, T., Charlet, I., Plantier, C., Chalupa, Z., Lugo-Alvarez, J., Raskin, J.-P., Hutin, L., Casse, M.

المصدر: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2023 - IEEE 53rd European. :148-151 Sep, 2023

Relation: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC)

المؤلفون: Wei, E.M., Chamberlin, R.A., Kilmer, N., Kast, J., Connors, J.A., Williams, D.

المصدر: IEEE Journal of Microwaves IEEE J. Microw. Microwaves, IEEE Journal of. 3(2):587-598 Apr, 2023

المؤلفون: Perez-Bailon, J., Tarancon, M., Celma, S., Sanchez-Azqueta, C.

المصدر: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 72:1-7 2023

المؤلفون: Knezevic, T., Suligoj, T., Capan, I., Nanver, L.K.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 68(6):2810-2817 Jun, 2021

المؤلفون: Elyse McEntee Wei, Richard A. Chamberlin, Nate Kilmer, Joshua Kast, Jake A. Connors, Dylan Williams

المصدر: IEEE Journal of Microwaves, Vol 3, Iss 2, Pp 587-598 (2023)

مصطلحات موضوعية: Cryogenic measurement, large-signal network analysis, on-wafer measurement, vector network analysis, Telecommunication, TK5101-6720, Electric apparatus and materials. Electric circuits. Electric networks, TK452-454.4

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/10015198/; https://doaj.org/toc/2692-8388

URL الوصول: https://doaj.org/article/dbebf8c2fc26447d937564dc5ffbe0f7

المؤلفون: Gaopeng Xue, Toda, Masaya, Ono, Takahito

المصدر: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. :83-88 Apr, 2015

Relation: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

المؤلفون: Kawasaki, Shigeo, Seita, Harunobu, Kawashima, Munenari, Hori, Masakazu, Satoh, Kei, Suzuki, Yasunori

المصدر: 2010 Asia-Pacific Microwave Conference Microwave Conference Proceedings (APMC), 2010 Asia-Pacific. :1497-1500 Dec, 2010

Relation: 2010 Asia Pacific Microwave Conference - (APMC 2010)

المؤلفون: Song, I., Cardoso, A.S., Ying, H., Cho, M., Cressler, J.D.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 18(4):613-619 Dec, 2018

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