المؤلفون: Li, X., Song, D., Wu, Y., Liu, Y., Yang, W., Macian-Juan, R.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 32(4):1-5 Jun, 2022

المؤلفون: Drumea, A., Marghescu, C. I.

المصدر: 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2021 IEEE 27th International Symposium for. :374-377 Oct, 2021

Relation: 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)

المؤلفون: Fanfan Wang, Zexin Liu, Jinfeng Li, Jian Huang, Li Fang, Xiaofeng Wang, Ruiwen Dai, Kangyong Li, Rong Zhang, Xiaoran Yang, Yue Yue, Zhiqiang Wang, Yuan Gao, Kai Yang, Lifu Zhang, Guoqing Xin

المصدر: Advanced Science, Vol 11, Iss 25, Pp n/a-n/a (2024)

مصطلحات موضوعية: current‐carrying capability, fluorinated graphene, heat dissipation, monolayer lateral heterostructure, thermal conductivity, thermal management, Science

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2198-3844

URL الوصول: https://doaj.org/article/35d512d3acc7495981171b7d431ca0ae

المؤلفون: Li, Weiguo, Yang, Xu, Zhang, Changhong, Huang, Zhongkang, Chu, Jinwei, Nan, Zhenle

المصدر: 2019 IEEE 3rd International Electrical and Energy Conference (CIEEC) Electrical and Energy Conference (CIEEC), 2019 IEEE 3rd International. :2017-2023 Sep, 2019

Relation: 2019 IEEE 3rd International Electrical and Energy Conference (CIEEC)

المؤلفون: Zhang, W., Wang, R., Cheng, S., Gu, S., Zhang, S., He, B., Qiao, M., Li, Z., Zhang, B.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 40(12):1969-1972 Dec, 2019

المؤلفون: Syed-Khaja, Aarief, Perez, Philip Patino, Franke, Joerg

المصدر: 2016 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2016 IEEE. :255-258 Nov, 2016

Relation: 2016 IEEE CPMT Symposium Japan (ICSJ)

المؤلفون: Li, Yan^Aff41, He, Darui^Aff41, Han, Xiao^Aff41, Wang, Qiong^Aff41

المساهمون: Angrisani, Leopoldo, Series Editor^Aff1, Arteaga, Marco, Series Editor^Aff2, Panigrahi, Bijaya Ketan, Series Editor^Aff3, Chakraborty, Samarjit, Series Editor^Aff4, Chen, Jiming, Series Editor^Aff5, Chen, Shanben, Series Editor^Aff6, Chen, Tan Kay, Series Editor^Aff7, Dillmann, Rüdiger, Series Editor^Aff8, Duan, Haibin, Series Editor^Aff9, Ferrari, Gianluigi, Series Editor^Aff10, Ferre, Manuel, Series Editor^Aff11, Hirche, Sandra, Series Editor^Aff12, Jabbari, Faryar, Series Editor^Aff13, Jia, Limin, Series Editor^Aff14, Kacprzyk, Janusz, Series Editor^Aff15, Khamis, Alaa, Series Editor^Aff16, Kroeger, Torsten, Series Editor^Aff17, Li, Yong, Series Editor^Aff18, Liang, Qilian, Series Editor^Aff19, Martín, Ferran, Series Editor^Aff20, Ming, Tan Cher, Series Editor^Aff21, Minker, Wolfgang, Series Editor^Aff22, Misra, Pradeep, Series Editor^Aff23, Möller, Sebastian, Series Editor^Aff24, Mukhopadhyay, Subhas, Series Editor^Aff25, Ning, Cun-Zheng, Series Editor^Aff26, Nishida, Toyoaki, Series Editor^Aff27, Oneto, Luca, Series Editor^Aff28, Pascucci, Federica, Series Editor^Aff29, Qin, Yong, Series Editor^Aff30, Seng, Gan Woon, Series Editor^Aff31, Speidel, Joachim, Series Editor^Aff32, Veiga, Germano, Series Editor^Aff33, Wu, Haitao, Series Editor^Aff34, Zamboni, Walter, Series Editor^Aff35, Zhang, Junjie James, Series Editor^Aff36, He, Jinghan, editor^Aff37, Li, Yaohua, editor^Aff38, Yang, Qingxin, editor^Aff39, Liang, Xidong, editor^Aff40

المصدر: The proceedings of the 16th Annual Conference of China Electrotechnical Society : Volume III. 891:1267-1276

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المؤلفون: Shi, Hong, Tan, Siow Chek, Refai-Ahmed, Gamal, Ramalingam, Suresh, Ahn, Jae-Gyung

المصدر: 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Electrical Design of Advanced Packaging and Systems (EDAPS), 2016 IEEE. :43-45 2016

Relation: 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

المؤلفون: Li, Yi^Aff4, Moon, Kyoung-sik (Jack)^Aff4, Wong, C. P. (Ching-Ping)^Aff4

المساهمون: Wong, C. P.(Ching-Ping), editor^Aff1, Moon, Kyoung-sik (Jack), editor^Aff2, Li, Yi, editor^Aff3

المصدر: Nano-Bio- Electronic, Photonic and MEMS Packaging. :15-30