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1مؤتمر
المؤلفون: da Silva, S. M., Stiens, J., Swart, J. W., Moshkal, S., Zhang, Y., Matvejev, V., Vandermeiren, W., de Tandt, C.
المصدر: 2017 32nd Symposium on Microelectronics Technology and Devices (SBMicro) Microelectronics Technology and Devices (SBMicro), 2017 32nd Symposium on. :1-4 Aug, 2017
Relation: 2017 32nd Symposium on Microelectronics Technology and Devices (SBMicro)
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2مؤتمر
المؤلفون: Zhu, B., Vanloocke, S., Stiens, J., De Zutter, D., Elhawil, A., De Tandt, C., Vounckx, R.
المصدر: Proceedings of the 5th European Conference on Antennas and Propagation (EUCAP) Antennas and Propagation (EUCAP), Proceedings of the 5th European Conference on. :745-748 Apr, 2011
Relation: 2011 5th European Conference on Antennas and Propagation (EuCAP)
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3مؤتمر
المؤلفون: Stiens, J., Matvejev, V., De Tandt, C., Ranson, W., Mangelings, D., Willaert, R., De Raedt, W.
المصدر: 2013 IEEE Topical Conference on Biomedical Wireless Technologies, Networks, and Sensing Systems Biomedical Wireless Technologies, Networks, and Sensing Systems (BioWireleSS), 2013 IEEE Topical Conference on. :58-60 Jan, 2013
Relation: 2013 IEEE Topical Conference on Biomedical Wireless Technologies, Networks, and Sensing Systems (BioWireleSS)
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4مؤتمر
المؤلفون: Sheng, L.Y., de Tandt, C., Ranson, W., Vounckx, R.
المصدر: 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059) Reliability physics Reliability Physics Symposium, 2000. Proceedings. 38th Annual 2000 IEEE International. :112-117 2000
Relation: 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual
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5مؤتمر
المؤلفون: Pan, W., De Tandt, C., Devisch, F., Vounckx, R., Kuijk, M.
المصدر: IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 1999. :29-32 1999
Relation: IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging
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6دورية أكاديمية
المؤلفون: Elhawil, A., Stiens, J., De Tandt, C., Ranson, W., Vounckx, R.
المصدر: IEEE Journal of Selected Topics in Quantum Electronics IEEE J. Select. Topics Quantum Electron. Selected Topics in Quantum Electronics, IEEE Journal of. 16(2):380-385 Apr, 2010
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7دورية أكاديمية
المؤلفون: Devisch, F., Maillard, X., Wei Pan, De Tandt, C., Vounckx, R., Kuijk, M.
المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 25(1):92-97 Feb, 2002
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8مؤتمر
المؤلفون: Pan, W., Devisch, F., De Tandt, C., Vounckx, R., Kuijk, M.
المصدر: Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) Interconnect technology Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International. :228-230 2000
Relation: Proceedings of the IEEE 2000 International Interconnect Technology Conference
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9دورية أكاديمية
المؤلفون: Agadi, K., Heremans, P., Kuijk, M., De Tandt, C., Borghs, G., Vounckx, R.
المصدر: IEEE Circuits and Devices Magazine IEEE Circuits Devices Mag. Circuits and Devices Magazine, IEEE. 13(4):24-29 Jul, 1997
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10مؤتمر
المؤلفون: Matvejev, V., De Tandt, C., Ranson, W., Stiens, J.
المصدر: 35th International Conference on Infrared, Millimeter, and Terahertz Waves Infrared Millimeter and Terahertz Waves (IRMMW-THz), 2010 35th International Conference on. :1-2 Sep, 2010
Relation: 2010 35th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz 2010)