المؤلفون: Verreck, D., Arreghini, A., den Bosch, G. Van, Furnemont, A., Rosmeulen, M.

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Relation: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

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Relation: 2021 Symposium on VLSI Technology

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المصدر: In Solid State Electronics January 2023 199

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Relation: 2019 IEEE International Electron Devices Meeting (IEDM)