المؤلفون: Hu, Liangxing, Lim, Yu Dian, Zhao, Peng, Zhong Lim, Michael Joo, Seng Tan, Chuan

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :324-329 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Kim, Juno, Lim, Kyeongbin, Hahn, Seung Ho, Lee, Mingu, Rhee, Daniel Min Woo

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1754-1760 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Ong, Jia Juen, Shie, Kai-Cheng, Tu, King-Ning, Chen, Chih

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :203-210 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Rajan, Sreejith Kochupurackal, Li, Ming Jui, Bakir, Muhannad S., May, Gary S

المصدر: 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-4 Oct, 2019

Relation: 2019 International 3D Systems Integration Conference (3DIC)

المؤلفون: Li, Suny^Aff2

المساهمون: Li, Suny, editor^Aff1

المصدر: MicroSystem Based on SiP Technology. :329-361

المؤلفون: Jia-Juen Ong, Dinh-Phuc Tran, Shih-Chi Yang, Kai-Cheng Shie, Chih Chen

المصدر: Metals, Vol 11, Iss 11, p 1864 (2021)

مصطلحات موضوعية: highly -oriented nanotwinned copper, die-to-die bonding, die-to-wafer bonding, post-annealing, grain growth, die shear test, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2075-4701/11/11/1864; https://doaj.org/toc/2075-4701

URL الوصول: https://doaj.org/article/1e393c7a30df46e085ef972288f6a5d5

المؤلفون: Jia-Juen Ong, Dinh-Phuc Tran, Shih-Chi Yang, Kai-Cheng Shie, Chih Chen

المصدر: Metals, Vol 11, Iss 1864, p 1864 (2021)

مصطلحات موضوعية: Mining engineering. Metallurgy, highly <111>-oriented nanotwinned copper, die shear test, TN1-997, grain growth, die-to-die bonding, die-to-wafer bonding, post-annealing

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doajarticles::1141ae5ce58ebb11cb6b2996ed07d891
https://www.mdpi.com/2075-4701/11/11/1864

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