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1مؤتمر
المؤلفون: Kennes, Koen, Lin, Ye, Suhard, Samuel, Bex, Pieter, Cuypers, Dieter H., Guerrero, Alice, Bumueller, Dennis, Phommahaxay, Alain, Beyer, Gerald, Beyne, Eric
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :637-642 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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2مؤتمر
المؤلفون: Inoue, Fumihiro, Teranishi, Shunsuke, Iwata, Tomoya, Onishi, Koki, Yamamoto, Naoko, Kawai, Akihito, Aoki, Shimpei, Hare, Takashi, Uedono, Akira
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :556-563 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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3مؤتمر
المؤلفون: Noda, Hiroto, Hiro, Akito, Nishiguchi, Naoki, Derakhshandeh, Jabber, Slabbekoorn, John, Beyne, Eric
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1677-1681 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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4مؤتمر
المؤلفون: Kennes, Koen, Phommahaxay, Alain, Guerrero, Alice, Suhard, Samuel, Bex, Pieter, Brems, Steven, Liu, Xiao, Tussing, Sebastian, Beyer, Gerald, Beyne, Eric
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2058-2063 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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5مؤتمر
المؤلفون: Kim, Juno, Min, Dae Ho, Lee, Kangsan, Lee, Mingu, Lim, Kyeongbin, Rhee, Daniel Minwoo
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :157-161 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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6مؤتمر
المؤلفون: Hu, Liangxing, Goh, Simon Chun Kiat, Lim, Yu Dian, Zhao, Peng, Lim, Michael Joo Zhong, Tan, Chuan Seng
المصدر: 2021 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2021 IEEE International. :1-5 Oct, 2021
Relation: 2021 IEEE International 3D Systems Integration Conference (3DIC)
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7مؤتمر
المؤلفون: Kennes, Koen, Phommahaxay, Alain, Guerrero, Alice, Bumueller, Dennis, Suhard, Samuel, Bex, Pieter, Tussing, Sebastian, Liu, Xiao, Beyer, Gerald, Beyne, Eric
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2126-2133 Jun, 2021
Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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8مؤتمر
المؤلفون: Ong, Jia Juen, Shie, Kai-Cheng, Tu, King-Ning, Chen, Chih
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :203-210 Jun, 2021
Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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9مؤتمر
المؤلفون: Kennes, Koen, Phommahaxay, Alain, Guerrero, Alice, Bauder, Olga, Suhard, Samuel, Bex, Pieter, Iacovo, Serena, Liu, Xiao, Schmidt, Thomas, Beyer, Gerald, Beyne, Eric
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :296-302 Jun, 2020
Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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10مؤتمر
المؤلفون: Lujan, Amy Palesko
المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :129-130 May, 2022
Relation: 2022 International Conference on Electronics Packaging (ICEP)