يعرض 1 - 10 نتائج من 43 نتيجة بحث عن '"die-to-wafer bonding"', وقت الاستعلام: 1.10s تنقيح النتائج
  1. 1
    مؤتمر
    Multi-tier die stacking through collective die-to-wafer hybrid bonding

    المؤلفون: Kennes, Koen, Lin, Ye, Suhard, Samuel, Bex, Pieter, Cuypers, Dieter H., Guerrero, Alice, Bumueller, Dennis, Phommahaxay, Alain, Beyer, Gerald, Beyne, Eric

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :637-642 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Inorganic Temporary Direct Bonding for Collective Die to Wafer Hybrid Bonding

    المؤلفون: Inoue, Fumihiro, Teranishi, Shunsuke, Iwata, Tomoya, Onishi, Koki, Yamamoto, Naoko, Kawai, Akihito, Aoki, Shimpei, Hare, Takashi, Uedono, Akira

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :556-563 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    An Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding Sysem

    المؤلفون: Noda, Hiroto, Hiro, Akito, Nishiguchi, Naoki, Derakhshandeh, Jabber, Slabbekoorn, John, Beyne, Eric

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1677-1681 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Carrier Systems for Collective Die-to-Wafer Bonding

    المؤلفون: Kennes, Koen, Phommahaxay, Alain, Guerrero, Alice, Suhard, Samuel, Bex, Pieter, Brems, Steven, Liu, Xiao, Tussing, Sebastian, Beyer, Gerald, Beyne, Eric

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2058-2063 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    A Performance Testing Method of Bernoullie Picker for Ultra-Thin Die Handling Application

    المؤلفون: Kim, Juno, Min, Dae Ho, Lee, Kangsan, Lee, Mingu, Lim, Kyeongbin, Rhee, Daniel Minwoo

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :157-161 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions

    المؤلفون: Hu, Liangxing, Goh, Simon Chun Kiat, Lim, Yu Dian, Zhao, Peng, Lim, Michael Joo Zhong, Tan, Chuan Seng

    المصدر: 2021 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2021 IEEE International. :1-5 Oct, 2021

    Relation: 2021 IEEE International 3D Systems Integration Conference (3DIC)

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  7. 7
    مؤتمر
    Acoustic modulation during laser debonding of collective hybrid bonded dies

    المؤلفون: Kennes, Koen, Phommahaxay, Alain, Guerrero, Alice, Bumueller, Dennis, Suhard, Samuel, Bex, Pieter, Tussing, Sebastian, Liu, Xiao, Beyer, Gerald, Beyne, Eric

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2126-2133 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    Two-step fabrication process for die-to-die and die-to-wafer Cu-Cu bonds

    المؤلفون: Ong, Jia Juen, Shie, Kai-Cheng, Tu, King-Ning, Chen, Chih

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :203-210 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer

    المؤلفون: Kennes, Koen, Phommahaxay, Alain, Guerrero, Alice, Bauder, Olga, Suhard, Samuel, Bex, Pieter, Iacovo, Serena, Liu, Xiao, Schmidt, Thomas, Beyer, Gerald, Beyne, Eric

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :296-302 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  10. 10
    مؤتمر
    Cost and Yield Analysis of Die-to-Wafer Hybrid Bonding

    المؤلفون: Lujan, Amy Palesko

    المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :129-130 May, 2022

    Relation: 2022 International Conference on Electronics Packaging (ICEP)

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