يعرض 1 - 10 نتائج من 6,632 نتيجة بحث عن '"dimple"', وقت الاستعلام: 1.48s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Proposing a New Egg-Shaped Profile to Further Enhance the Hydrothermal Performance of Extended Dimple Tubes in Turbulent Flows

    المؤلفون: Darbandi, MasoudAff1, IDs13369024094909_cor1, Mashayekh, Kazem, Abdollahpour, Mohammad-Saleh

    المصدر: Arabian Journal for Science and Engineering. :1-16

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  2. 2
    دورية أكاديمية
    Development of surface textures using micro-milling operation for improved tribological characteristics of aluminium alloy

    المؤلفون: Sahu, Vikas KumarAff1, IDs0017002414289x_cor1, Shukla, Pravesh Chandra, Gangopadhyay, Soumya

    المصدر: The International Journal of Advanced Manufacturing Technology. :1-16

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  3. 3
    دورية أكاديمية
    Heat transfer enhancement in double pipe heat exchanger: exploring twisted tape inserts with dimple configuration

    المؤلفون: Heeraman, JatothAff1, IDs1097302413200w_cor1, Sandeep, Chinta, Chaurasiya, Prem Kumar

    المصدر: Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. 149(16):8839-8856

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  4. 4
    دورية أكاديمية
    Computational parametric investigation of solar air heater with dimple roughness in S-shaped pattern

    المؤلفون: Singh, Jagjeet, Bisht, Vijay Singh, Bhandari, Prabhakar, Kumar, Kaushal, Singh, Jarnail, Alam, Tabish, Dixit, SauravAff5, Aff6, IDs12008023013928_cor7, Singh, Subhav, Khusnutdinov, Rinat

    المصدر: International Journal on Interactive Design and Manufacturing (IJIDeM). 18(5):2969-2979

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  5. 5
    مؤتمر
    Toward a Polysilicon-Based Electrostatically Actuated DC MEMS Switch

    المؤلفون: Shuaibu, Abdurrashid Hassan, Blaquiere, Yves, Nabki, Frederic

    المصدر: 2023 21st IEEE Interregional NEWCAS Conference (NEWCAS) Interregional NEWCAS Conference (NEWCAS), 2023 21st IEEE. :1-4 Jun, 2023

    Relation: 2023 21st IEEE Interregional NEWCAS Conference (NEWCAS)

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  6. 6
    مؤتمر
    A CFD Study of Deposition Characteristics of Particles in Three-dimensional Heat Transfer Channel with Dimple-type Roughness Elements

    المؤلفون: Han, Zunshi, Lu, Hao, Zhang, Yanmin, Han, Pengyuan, Liu, Yongxia, Ge, Xuesong

    المصدر: 2022 4th International Conference on Smart Power & Internet Energy Systems (SPIES) Smart Power & Internet Energy Systems (SPIES), 2022 4th International Conference on. :99-103 Dec, 2022

    Relation: 2022 4th International Conference on Smart Power & Internet Energy Systems (SPIES)

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  7. 7
    دورية أكاديمية
    Experimental investigation on the characteristics of inline dimple-based SAH with dimple pitch variation

    المؤلفون: Panda, Sudharani, Kumar, RakeshAff1, IDs10973024130886_cor2

    المصدر: Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. 149(12):6649-6670

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  8. 8
    دورية أكاديمية
    Investigation on the wear resistance of AISI 316L with micro dimples as a material for human implants’ structure

    المؤلفون: Lee, Hyeon Hwa, Kim, Jong SuAff1, IDs122060240429x_cor2, Park, Jeong Yeon, Lee, SungcheulAff2, IDs122060240429x_cor4

    المصدر: Journal of Mechanical Science and Technology. 38(5):2507-2517

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  9. 9
    دورية أكاديمية
    Effect of Ablation Casting Process on the Microstructural Parameters and Tensile Properties of A413 and A356 Alloys

    المؤلفون: Arabpour, Mostafa, Boutorabi, Seyed Mohammad AliAff1, IDs40962023010938_cor2, Saghafian, Hasan

    المصدر: International Journal of Metalcasting. 18(2):1619-1632

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  10. 10
    مؤتمر
    Liquid cooling solutions for Automotive HPC: Thermal path characterisation

    المؤلفون: Grun, Tobias, May, Daniel, Straub, Hubert, Jakub, Gromala Przemyslaw, Wunderle, Bernhard, Verleysen, Willem

    المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-7 Apr, 2022

    Relation: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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