المؤلفون: Boe, Patrick, Schadte, Philipp, Adelung, Rainer, Siebert, Leonard, Hoft, Michael

المصدر: 2024 IEEE International Microwave Filter Workshop (IMFW) Microwave Filter Workshop (IMFW), 2024 IEEE International. :99-101 Feb, 2024

Relation: 2024 IEEE International Microwave Filter Workshop (IMFW)

المؤلفون: Lee, B.M., Nguyen, Q.H., Shen, W.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(6):7584-7592 Mar, 2024

المؤلفون: Baysal, Hasan E., Molina-Lopez, Francisco

المصدر: 2023 IEEE International Flexible Electronics Technology Conference (IFETC) Flexible Electronics Technology Conference (IFETC), 2023 IEEE International. :01-03 Aug, 2023

Relation: 2023 IEEE International Flexible Electronics Technology Conference (IFETC)

المؤلفون: Janda, Martin, Pretl, Silvan, Radouchova, Michaela, Michal, David, Lotfi, Saeedeh, Reboun, Jan

المصدر: 2023 46th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2023 46th International Spring Seminar on. :1-5 May, 2023

Relation: 2023 46th International Spring Seminar on Electronics Technology (ISSE)

المؤلفون: Lotfi, Saeedeh, Janda, Martin, Blecha, Tomas

المصدر: 2023 46th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2023 46th International Spring Seminar on. :1-5 May, 2023

Relation: 2023 46th International Spring Seminar on Electronics Technology (ISSE)

المؤلفون: Al-Haidari, Riadh, Alhendi, Mohammed, Richmond, Dylan, Abbara, El Mehdi, Obeidat, Abdullah, Somarathna, Udara S., Schadt, Mark, Poliks, Mark, Gowda, Arun V., Erlbaum, Jeff, Xiong, Han, Hitchcock, Collin

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :668-675 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Hossain, Sk Saddam, Akhtar, Farid

المصدر: Journal of the European Ceramic Society. 44(11):6620-6628

مصطلحات موضوعية: Alumina, Direct ink writing, Hollow microsphere, Low-density Foam, Porosity, Engineering Materials, Materialteknik

وصف الملف: electronic

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:ltu:diva-105216
https://doi.org/10.1016/j.jeurceramsoc.2024.04.020
https://ltu.diva-portal.org/smash/get/diva2:1853781/FULLTEXT02.pdf

المؤلفون: Yao, Pinjing, Li, Wangyang^{Aff1, Aff2, Aff3, IDs408430242920x_cor2}, Ke, Bingyuan, Chen, Lihui, Jian, Yijia, Qiao, Huawei, Zhang, Huagui, Yang, Hui Ying^{Aff5, IDs408430242920x_cor8}, Wang, Xinghui^{Aff1, Aff2, Aff3, IDs408430242920x_cor9}

المصدر: Science China Materials. 67(6):1956-1964

المؤلفون: Wang, Shijie, Duan, Guolin^{Aff1, IDs00170024135801_cor2}

المصدر: The International Journal of Advanced Manufacturing Technology. 132(7-8):3415-3426

المؤلفون: Zhang, Yan, Zhang, Huandi, Wang, Xiaoxiao, Tang, Cheng, Shi, Xiaowei, Zhao, Zehua, Liu, Jiamei, Wang, Guolong, Shen, Jianfeng, Li, Lei^{Aff1, IDs1227402466479_cor10}

المصدر: Nano Research. :1-9