يعرض 1 - 10 نتائج من 7,723 نتيجة بحث عن '"dispensing"', وقت الاستعلام: 1.04s تنقيح النتائج
  1. 1
    مؤتمر
    Development of a Non-Contact Jet Dispensing of Liquid Metals

    المؤلفون: Maslik, Jan, Martensson, Gustaf, Gumiero, Alessandro, Cometti, Elio, Hjort, Klas

    المصدر: 2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Microelectronics Packaging (NordPac), 2024 IMAPS Nordic Conference on. :1-6 Jun, 2024

    Relation: 2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

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  2. 2
    مؤتمر
    Thermal Performance and Reliability of Liquid Metal Alloys as Thermal Interface Materials for Computing Electronics Devices

    المؤلفون: Fan, Guangyu, Wells, Jacob, Beam, Micheal

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1705-1711 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    A Privacy Protection Application of Consumer Personal Information Based on an Improved K-Anonymity Algorithm

    المؤلفون: Wang, Fei, Chen, Huali, Zhou, Yi

    المصدر: 2024 5th International Conference for Emerging Technology (INCET) Emerging Technology (INCET), 2024 5th International Conference for. :1-7 May, 2024

    Relation: 2024 5th International Conference for Emerging Technology (INCET)

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  4. 4
    مؤتمر
    IoT-Enabled E-Prescription Management and Dispensing Machine Monitoring

    المؤلفون: Elshaer, A. M., Mostafa, Moamen, Elrakaiby, Mahmoud, Elmanfaloty, Rania A., Abou-Bakr, Ehab

    المصدر: 2024 14th International Conference on Electrical Engineering (ICEENG) Electrical Engineering (ICEENG), 2024 14th International Conference on. :243-247 May, 2024

    Relation: 2024 14th International Conference on Electrical Engineering (ICEENG)

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  5. 5
    مؤتمر
    Low Temperature Adhesive Die Bonding for Sensitive MEMS Dies

    المؤلفون: Beena, Nithin Anujan, Lorenz, Lukas, Ludewig, Thomas, Swiecinski, Kai, Bock, Volker

    المصدر: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-9 May, 2024

    Relation: 2024 47th International Spring Seminar on Electronics Technology (ISSE)

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  6. 6
    مؤتمر
    Horticulture Robot for Precision Plant Health Management

    المؤلفون: Hruday, Pemula Jaxa, Kiran, Anakapalli Bharath Venkata Siva, Prasad Reddy, V H

    المصدر: 2024 10th International Conference on Communication and Signal Processing (ICCSP) Communication and Signal Processing (ICCSP), 2024 10th International Conference on. :448-452 Apr, 2024

    Relation: 2024 10th International Conference on Communication and Signal Processing (ICCSP)

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  7. 7
    دورية أكاديمية
    Research on Adhesive Quality Control Based on Piezoelectric Dispensing Valve

    المؤلفون: Du, B., Liu, F., Cui, H., Wang, J., Zhou, M., Huang, X., Yang, C., Zou, C., Yan, X.

    المصدر: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 71(1):912-921 Jan, 2024

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  8. 8
    مؤتمر
    Design and Analysis of Piezoelectric Aided Dispensing System for Fluid Droplet Generation

    المؤلفون: Salehian, Sara, Rad, Pouya Firuzy, Ghafarirad, Hamed

    المصدر: 2023 11th RSI International Conference on Robotics and Mechatronics (ICRoM) Robotics and Mechatronics (ICRoM), 2023 11th RSI International Conference on. :756-761 Dec, 2023

    Relation: 2023 11th RSI International Conference on Robotics and Mechatronics (ICRoM)

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  9. 9
    مؤتمر
    Integration Of AI and IoT In Medminder and Dosette Box

    المؤلفون: Kumar, B. Sakthi, Dhanasekar, S., Kumar, L. Naveen, Naveenkumar, T., Raghul, S., Celecia, R. Ralynn

    المصدر: 2023 International Conference on Next Generation Electronics (NEleX) Next Generation Electronics (NEleX), 2023 International Conference on. :1-5 Dec, 2023

    Relation: 2023 International Conference on Next Generation Electronics (NEleX)

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  10. 10
    مؤتمر
    Overcoming Assembly Process Challenges in Glass Interposer: Development of Jigs and Fixtures

    المؤلفون: Ubed, Mohammed, Ramana, Pamidigantam, Veerandi, Anusha, Kumar Yeluripati, Rohin, G, VenuGopal

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :165-168 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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