المؤلفون: Luo, Kai, Li, Chen, Santi, Enrico

المصدر: 2023 IEEE Electric Ship Technologies Symposium (ESTS) Electric Ship Technologies Symposium (ESTS), 2023 IEEE. :337-342 Aug, 2023

Relation: 2023 IEEE Electric Ship Technologies Symposium (ESTS)

المؤلفون: Nanou, Paraskevi, Zarkadoulas, Athanasios, Pandis, Pavlos K.^{Aff1, Aff2}, Tsilikas, Ioannis^{Aff3, Aff4}, Katis, Ilias, Almpani, Despoina, Orfanoudakis, Nikolaos, Vourdas, Nikolaos, Stathopoulos, Vassilis^{Aff1, Aff2, IDs0017002413701w_cor9}

المصدر: The International Journal of Advanced Manufacturing Technology. 133(1-2):307-319

المؤلفون: Lam, Cheuk, Donati, Matteo, Regulagadda, Kartik, Yavuz, Emre, Pfeiffer, Till, Sarkiris, Panagiotis, Gogolides, Evangelos, Milionis, Athanasios, Poulikakos, Dimos, Butt, Hans-Jürgen, Kappl, Michael, Li, Shuai

المصدر: ACS Applied Materials and Interfaces. 16(1)

مصطلحات موضوعية: dropwise condensation, durability, heat transfer, polydimethylsiloxane, transition, wetting

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/4ch2b65m

المؤلفون: Chattoraj, Tridibesh^{Aff1, IDs1204602402478z_cor1}, Chatterjee, Avishek^{Aff1, IDs1204602402478z_cor2}, Thomas, Tibin M, Mahapatra, Pallab Sinha^{Aff2, IDs1204602402478z_cor4}, Mukhopadhyay, Achintya^{Aff1, IDs1204602402478z_cor5}

المصدر: Sādhanā: Published by the Indian Academy of Sciences. 49(2)

المؤلفون: Raza, Waquar^{Aff14, Aff14}, Narayanaswamy, Ramesh^Aff15, Muralidhar, K.^Aff14

المساهمون: Chaari, Fakher, Series Editor^Aff1, Gherardini, Francesco, Series Editor^Aff2, Ivanov, Vitalii, Series Editor^Aff3, Haddar, Mohamed, Series Editor^Aff4, Cavas-Martínez, Francisco, Editorial Board Member^Aff5, di Mare, Francesca, Editorial Board Member^Aff6, Kwon, Young W., Editorial Board Member^Aff7, Trojanowska, Justyna, Editorial Board Member^Aff8, Xu, Jinyang, Editorial Board Member^Aff9, Singh, Krishna Mohan, editor^Aff10, Dutta, Sushanta, editor^Aff11, Subudhi, Sudhakar, editor^Aff12, Singh, Nikhil Kumar, editor^Aff13

المصدر: Fluid Mechanics and Fluid Power, Volume 5 : Select Proceedings of FMFP 2022. :361-374

المؤلفون: Volk, Marie-Christine^Aff18, Niehaus, Konstantin^{Aff19, Aff20}, Westhoff, Andreas^Aff19, Wagner, Claus^{Aff19, Aff20}

المساهمون: Hirschel, Ernst Heinrich, Founding Editor^Aff1, Schröder, Wolfgang, Series Editor^Aff2, Boersma, Bendiks Jan, Editorial Board Member^Aff3, Fujii, Kozo, Editorial Board Member^Aff4, Haase, Werner, Editorial Board Member^Aff5, Leschziner, Michael A., Editorial Board Member^Aff6, Periaux, Jacques, Editorial Board Member^Aff7, Pirozzoli, Sergio, Editorial Board Member^Aff8, Rizzi, Arthur, Editorial Board Member^Aff9, Roux, Bernard, Editorial Board Member^Aff10, Shokin, Yurii I., Editorial Board Member^Aff11, Lagemann, Esther, Managing Editor^Aff12, Dillmann, Andreas, editor^Aff13, Heller, Gerd, editor^Aff14, Krämer, Ewald, editor^Aff15, Wagner, Claus, editor^Aff16, Weiss, Julien, editor^Aff17

المصدر: New Results in Numerical and Experimental Fluid Mechanics XIV : Contributions to the 23rd STAB/DGLR Symposium, Berlin, Germany, 2022. 154:579-589

المؤلفون: Damoulakis, George, Gukeh, Mohamad Jafari, Moitra, Shashwata, Megaridis, Constantine M.

المصدر: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :1015-1023 Jun, 2021

Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Azarifar, M., Budakli, M., Basol, A.M., Arik, M.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(10):1668-1678 Oct, 2021

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المؤلفون: Tsai, Emily, Vaz, Lara, Yeung, Alan, Klein, Lisa C., Jenkins, Sydney

المصدر: 2019 IEEE MIT Undergraduate Research Technology Conference (URTC) MIT Undergraduate Research Technology Conference (URTC), 2019 IEEE. :1-4 Oct, 2019

Relation: 2019 IEEE MIT Undergraduate Research Technology Conference (URTC)