المؤلفون: Huang, B., Hsieh, W., Tu, C., Liu, Y., Chen, Y., Chen, W., Cheng, C., Chou, H., Liu, C.W.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 45(6):956-959 Jun, 2024

المؤلفون: Gasc, Sebastien, Binda, Federico, Kanungo, Pratyush Das, Hofer, Lukas, Rothenberger, Maximilian

المصدر: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2024 35th Annual. :01-04 May, 2024

Relation: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

المؤلفون: Sano, Ko-hei, Nagai, Sho, Ono, Yoshitaka, Hayashi, Yasuo, Yanagitani, Takahiko

المصدر: 2024 IEEE MTT-S International Conference on Microwave Acoustics & Mechanics (IC-MAM) Microwave Acoustics & Mechanics (IC-MAM), 2024 IEEE MTT-S International Conference on. :41-44 May, 2024

Relation: 2024 IEEE MTT-S International Conference on Microwave Acoustics & Mechanics (IC-MAM)

المؤلفون: Yamamoto, Soma, Fukushige, Yuho, Nishizawa, Hideaki, Khajornrungruang, Panart, Suzuki, Keisuke

المصدر: 2024 1st International Conference on Robotics, Engineering, Science, and Technology (RESTCON) Robotics, Engineering, Science, and Technology (RESTCON), 2024 1st International Conference on. :55-58 Feb, 2024

Relation: 2024 1st International Conference on Robotics, Engineering, Science, and Technology (RESTCON)

المؤلفون: Hsiang-Yao, Hsiao, Ley, Ryan, Suo, Peng, Bum, Andy Yong Chang, Quon, Roger

المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :391-395 Dec, 2023

Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Sharma, Jaibir, Chen, Daniel Ssu-Han, Shun Teo, Yong, Liu, Peng

المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :864-868 Dec, 2023

Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Zhang, Bingke, Zhu, Tao, Bai, Xue, Wang, Haixing, Wang, Rui, Chang, Shucheng, Sun, Junmin, Li, Zhe Yang, Jin, Rui

المصدر: 2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS) Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS), 2023 20th China International Forum on. :129-132 Nov, 2023

Relation: 2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)

المؤلفون: Barsoum, S., Schembri, A., Bernard, M., Lefevre, A., Bousquet, M., Reinhardt, A., Laroche, T., Ballandras, S., Dubus, B.

المصدر: 2023 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2023 IEEE International. :1-4 Sep, 2023

Relation: 2023 IEEE International Ultrasonics Symposium (IUS)

المؤلفون: Chang, Wei-Yuan, Luo, Guang-Li, Chu, Chun-Lin, Chen, Shih-Hong, Hsueh, Fu-Kuo, Chen, Bo-Yuan, Lee, Yao-Jen, Wu, Wen-Fa

المصدر: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) Technology, Systems and Applications (VLSI TSA), 2024 International VLSI Symposium on. :1-2 Apr, 2024

Relation: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)

المؤلفون: Sano, Ko-Hei, Ono, Yoshitaka, Imamura, Yutaka, Hayashi, Yasuo, Yanagitani, Takahiko

المصدر: 2023 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2023 IEEE International. :1-3 Sep, 2023

Relation: 2023 IEEE International Ultrasonics Symposium (IUS)