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1دورية أكاديمية
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(10):5190-5195 Oct, 2023
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2دورية أكاديمية
المؤلفون: Enlow, E., Diba, M., Clayton, J., Harris, B., Abbaszadeh, S.
المصدر: IEEE Transactions on Radiation and Plasma Medical Sciences IEEE Trans. Radiat. Plasma Med. Sci. Radiation and Plasma Medical Sciences, IEEE Transactions on. 7(6):580-586 Jul, 2023
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3دورية أكاديمية
المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 23(9):9697-9706 May, 2023
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4دورية أكاديمية
المؤلفون: Galli, A., Peri, E., Rabotti, C., Ouzounov, S., Mischi, M.
المصدر: IEEE Transactions on Biomedical Engineering IEEE Trans. Biomed. Eng. Biomedical Engineering, IEEE Transactions on. 70(4):1196-1207 Apr, 2023
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5مؤتمر
المؤلفون: Li, Yang, Liu, Yushuai, Wu, Tao.
المصدر: 2022 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2022 IEEE International. :1-4 Oct, 2022
Relation: 2022 IEEE International Ultrasonics Symposium (IUS)
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6دورية أكاديمية
المصدر: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 72:1-10 2023
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7مؤتمر
المؤلفون: Reeves, Adam, Freyenberger, Mark, Hodder, Michael
المصدر: 2022 IEEE IAS Pulp and Paper Industry Conference (PPIC) Pulp and Paper Industry Conference (PPIC), 2022 IEEE IAS. :180-190 Jun, 2022
Relation: 2022 IEEE IAS Pulp and Paper Industry Conference (PPIC)
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8دورية أكاديمية
المصدر: IEEE Transactions on Biomedical Circuits and Systems IEEE Trans. Biomed. Circuits Syst. Biomedical Circuits and Systems, IEEE Transactions on. 16(5):962-971 Oct, 2022
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9دورية أكاديمية
المصدر: IEEE Transactions on Biomedical Engineering IEEE Trans. Biomed. Eng. Biomedical Engineering, IEEE Transactions on. 69(8):2414-2422 Aug, 2022
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10مؤتمر
المؤلفون: Anand, Shreyansh, Jandial, Prajna, Nersisson, Ruban
المصدر: 2021 Innovations in Power and Advanced Computing Technologies (i-PACT) Innovations in Power and Advanced Computing Technologies (i-PACT), 2021. :1-6 Nov, 2021
Relation: 2021 Innovations in Power and Advanced Computing Technologies (i-PACT)