المؤلفون: Kaufhold, Robin, Khan, Sherjeel, Kosel, Jurgen, Aghassi-Hagmann, Jasmin

المصدر: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Flexible and Printable Sensors and Systems (FLEPS), 2024 IEEE International Conference on. :1-4 Jun, 2024

Relation: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

المؤلفون: Philippin, Nadine, Kuehne, Ingo, Schrag, Gabriele

المصدر: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Flexible and Printable Sensors and Systems (FLEPS), 2024 IEEE International Conference on. :1-4 Jun, 2024

Relation: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

المؤلفون: Chen, Yiman^{Aff1, Aff2}, Chen, Huatan, Chen, Junyu, Jiang, Jiaxin, Shen, Ruimin^{Aff1, Aff2}, Lin, Junzhe, Liu, Yifang^{Aff1, Aff2, IDs0033902407718x_cor7}, Zheng, Gaofeng^{Aff1, Aff2, IDs0033902407718x_cor8}

المصدر: Applied Physics A: Materials Science & Processing. 130(8)

المؤلفون: Jingxuan Ma, Zicheng Sa, He Zhang, Jiayun Feng, Jiayue Wen, Shang Wang, Yanhong Tian

المصدر: Advanced Science, Vol 11, Iss 34, Pp n/a-n/a (2024)

مصطلحات موضوعية: electrodeposition, electrohydrodynamic printing, flexible electronics, liquid metal, multilayer circuits, Science

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2198-3844

URL الوصول: https://doaj.org/article/0383a3e5ed0b415ea6832d8908b1254d

المؤلفون: Xu, Y., Wang, H., Ye, D., Yang, R., Huang, Y., Miao, X.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 43(1):116-119 Jan, 2022

المؤلفون: Khan, Arshad, Ali, Shawkat, Khan, Saleem, Bermak, Amine

المصدر: 2021 IEEE International Symposium on Circuits and Systems (ISCAS). :1-4 May, 2021

Relation: 2021 IEEE International Symposium on Circuits and Systems (ISCAS)

المؤلفون: Nauman, Malik Muhammad, Zulfikre Esa, Mohammad, Zaini, Juliana Hj, Iqbal, Asif, Bakar, Saifullah Abu

المصدر: 2020 IEEE 11th International Conference on Mechanical and Intelligent Manufacturing Technologies (ICMIMT) Mechanical and Intelligent Manufacturing Technologies (ICMIMT), 2020 IEEE 11th International Conference on. :167-171 Jan, 2020

Relation: 2020 IEEE 11th International Conference on Mechanical and Intelligent Manufacturing Technologies (ICMIMT)

المؤلفون: Zhouping Yin, Dazhi Wang, Yunlong Guo, Zhiyuan Zhao, Liqiang Li, Wei Chen, Yongqing Duan

المصدر: InfoMat, Vol 6, Iss 2, Pp n/a-n/a (2024)

مصطلحات موضوعية: display, electrohydrodynamic printing, flexible electronics, organic field‐effect transistor, printhead, Materials of engineering and construction. Mechanics of materials, TA401-492, Information technology, T58.5-58.64

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2567-3165

URL الوصول: https://doaj.org/article/27a7d1197f2445a49caa452ca61d055e

المؤلفون: Das, Tiasa^Aff13, Biswas, Adrija^Aff13, Roy, Shibendu Shekhar^Aff13

المساهمون: Cavas-Martínez, Francisco, Editorial Board Member^Aff1, Chaari, Fakher, Series Editor^Aff2, di Mare, Francesca, Editorial Board Member^Aff3, Gherardini, Francesco, Series Editor^Aff4, Haddar, Mohamed, Editorial Board Member^Aff5, Ivanov, Vitalii, Series Editor^Aff6, Kwon, Young W., Editorial Board Member^Aff7, Trojanowska, Justyna, Editorial Board Member^Aff8, Deepak, B.B.V.L., editor^Aff9, Bahubalendruni, M.V.A. Raju, editor^Aff10, Parhi, D.R.K., editor^Aff11, Biswal, Bibhuti Bhusan, editor^Aff12

المصدر: Recent Trends in Product Design and Intelligent Manufacturing Systems : Select Proceedings of IPDIMS 2021. :709-717

المؤلفون: Wang, Xiang, Zheng, Gaofeng, Jiang, Jiaxin, Xu, Lei, Luo, Zhiwei, Li, Wenwang

المصدر: 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) Nano/Micro Engineered and Molecular Systems (NEMS), 2018 IEEE 13th Annual International Conference on. :308-311 Apr, 2018

Relation: 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)