يعرض 1 - 10 نتائج من 3,886 نتيجة بحث عن '"electronic packaging thermal management"', وقت الاستعلام: 1.57s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal

    المؤلفون: Iradukunda, A., Nafis, B.M., Huitink, D., Chen, Y., Mantooth, H.A., Campbell, G., Underwood, D.

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(5):784-794 May, 2024

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  2. 2
    مؤتمر
    Mitigating Cracking from RDL Stress in Glass Substrates with Low-CTE Electrodeposited Copper-Graphene Composites

    المؤلفون: Molina-Mangual, Christian, Surillo, Emanuel Torres, Nedumthakady, Nithin, Smet, Vanessa

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1552-1557 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Effect of Material Aging on the Reliability of an Automotive BGA Device Under Temperature Cycling Test Conditions

    المؤلفون: Fahim, Abdullah, Zhang, Ryan, Mavinkurve, Amar, Shantaram, Sandeep, Adli, Ali Rezaie, Tanwongwan, Wiwat, Hauck, Torsten

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2062-2069 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    A CMP Process for Hybrid Bonding Application with Conventional / nt-Cu and SixNy / SixOy Dielectrics

    المؤلفون: Widodo, T. S., Brun, X. F., Lianto, P., Tan, A., Lie, J., Lim, P., See, G. H.

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2058-2061 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Thermal Performance and Reliability of Liquid Metal Alloys as Thermal Interface Materials for Computing Electronics Devices

    المؤلفون: Fan, Guangyu, Wells, Jacob, Beam, Micheal

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1705-1711 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    Study of fabrication and reliability for 120 mm x 120 mm extremely large advanced 2.5D package

    المؤلفون: Hirano, Kazue, Kang, Dongchul, Takahashi, Masaki, Iseki, Takahiro, Murai, Kosuke, Katoh, Sadaaki

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :955-962 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Thermal resistance prediction model for IC packaging optimization and design cycle reduction

    المؤلفون: Chen, Guan-Wei, Lin, Yan-Cheng, Hsu, Chung-Hsiang, Chen, Tang-Yuan, Wang, Chen-Chao, Hung, Chin-Pin, Wang, Hung-Kai

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1593-1598 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    A Study of Chip-Package Interaction with All-Copper Interconnections on Advanced Glass Substrates

    المؤلفون: Sosa, Ramon A., Surillo, Emanuel Torres, Molina-Mangual, Christian, Smet, Vanessa

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1841-1847 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    One-step Surface Modification for Boron Nitride and its Polymer Composite of Enhanced Thermal Conductivity for Advanced Packaging Applications

    المؤلفون: Lin, Zihao, Li, Jiaxiong, Sun, Zhijian, Fang, Andrew D., Moon, Kyoung-Sik, Wong, Ching-Ping

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2003-2007 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  10. 10
    مؤتمر
    Impact of chip-package parameters on the thermomechanical reliability of high thermal die attach materials in RF, power, and automotive applications

    المؤلفون: Sakib, A R Nazmus, Ricon, Ruther, Eom, Jake, Kawashima, Yoshitsugu, Azuma, Kosuke, Tharumalingam, Ganesh, Kim, Young

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1108-1112 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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