المؤلفون: Du, Jianyu, Chen, Lang, Hu, Ran, Yu, Huaiqiang, Zhang, Chi, Wang, Wei

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2096-2100 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Feng, Huicheng, He, Bin, Tang, Gongyue, Zhang, Xiaowu, Lau, Boon Long, Yuen Jason, Keng, Javier Ong, Jun Wei, Chinq Jong, Ming

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1569-1574 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Du, Jianyu, Wu, Hongxu, Yu, Huaiqiang, Zhang, Chi, Wang, Wei

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1619-1622 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Zhao, Xiaoliang, Shu, Penghuai, Li, Wei, Wang, Zhenyu, Zhang, Xiaobin

المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-9 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Li, Wei, Ye, Yuxin, Yan, Yingzhan, Du, Xiangbin, Kong, Yanmei, Liu, Ruiwen, Wang, Zhiqiang, Jiao, Binbin

المصدر: 2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) Nano/Micro Engineered and Molecular Systems (NEMS), 2023 IEEE 18th International Conference on. :120-123 May, 2023

Relation: 2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

المؤلفون: Bognar, G., Takacs, G., Szabo, P.G.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(8):1155-1163 Aug, 2023

المؤلفون: Li, W., Qian, W., Zhao, X., Liu, Y., Wang, Z., Wang, W., Zhang, X., Zhao, Y.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(2):161-170 Feb, 2023

المؤلفون: Bognar, Gyorgy, Takacs, Gabor, Szabo, Peter G.

المصدر: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-4 Sep, 2022

Relation: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

المؤلفون: Du, Jianyu, Yang, Yuchi, Yu, Huaiqiang, Liu, Yulong, Kang, Jiajie, Wang, Wei

المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-6 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Schultz, Mark D., Parida, Pritish R., Chainer, Timothy

المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-8 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)