المؤلفون: Li, Xinran, Liu, Jinxing^{Aff1, IDs10704023007436_cor2}, Soh, Ai Kah

المصدر: International Journal of Fracture. 246(2-3):225-244

المؤلفون: Ding, Chugang^Aff42, Gao, Shibin^Aff42, Yu, Long^Aff42, Wang, Jian^Aff43, Zeng, Shaocong^Aff42

المساهمون: Angrisani, Leopoldo, Series Editor^Aff1, Arteaga, Marco, Series Editor^Aff2, Chakraborty, Samarjit, Series Editor^Aff3, Chen, Jiming, Series Editor^Aff4, Chen, Shanben, Series Editor^Aff5, Chen, Tan Kay, Series Editor^Aff6, Dillmann, Rüdiger, Series Editor^Aff7, Duan, Haibin, Series Editor^Aff8, Ferrari, Gianluigi, Series Editor^Aff9, Ferre, Manuel, Series Editor^Aff10, Jabbari, Faryar, Series Editor^Aff11, Jia, Limin, Series Editor^{Aff12, Aff38}, Kacprzyk, Janusz, Series Editor^Aff13, Khamis, Alaa, Series Editor^Aff14, Kroeger, Torsten, Series Editor^Aff15, Li, Yong, Series Editor^Aff16, Liang, Qilian, Series Editor^Aff17, Martín, Ferran, Series Editor^Aff18, Ming, Tan Cher, Series Editor^Aff19, Minker, Wolfgang, Series Editor^Aff20, Misra, Pradeep, Series Editor^Aff21, Mukhopadhyay, Subhas, Series Editor^Aff22, Ning, Cun-Zheng, Series Editor^Aff23, Nishida, Toyoaki, Series Editor^Aff24, Oneto, Luca, Series Editor^Aff25, Panigrahi, Bijaya Ketan, Series Editor^Aff26, Pascucci, Federica, Series Editor^Aff27, Qin, Yong, Series Editor^{Aff28, Aff39}, Seng, Gan Woon, Series Editor^Aff29, Speidel, Joachim, Series Editor^Aff30, Veiga, Germano, Series Editor^Aff31, Wu, Haitao, Series Editor^Aff32, Zamboni, Walter, Series Editor^Aff33, Zhang, Junjie James, Series Editor^Aff34, Tan, Kay Chen, Series Editor^Aff35, Yang, Jianwei, editor^Aff36, Yao, Dechen, editor^Aff37, Liu, Zhigang, editor^Aff40, Diao, Lijun, editor^Aff41

المصدر: Proceedings of the 6th International Conference on Electrical Engineering and Information Technologies for Rail Transportation (EITRT) 2023 : Safety Assurance and Operation Maintenance Technology of Rail Transportation System. 1136:88-95

المؤلفون: Paygozar, Bahman^{Aff1, IDs12666023029951_cor1}, Gorguluarslan, Recep M.

المصدر: Transactions of the Indian Institute of Metals. 76(11):3041-3048

المؤلفون: Hamamci, Benek^{Aff1, IDs00521023087963_cor1}

المصدر: Neural Computing and Applications. 35(28):20923-20938

المؤلفون: Amal Zamrawi, Ata El-Kareim Shoeib, Angelos Ibrahim, Samir M. Ahmed

المصدر: Frattura ed Integrità Strutturale, Vol 18, Iss 67, Pp 292-310 (2024)

مصطلحات موضوعية: concrete, flat slabs, post-tension, effect of opening, failure load, concentrated load, tension force on cable, shear, punching, Mechanical engineering and machinery, TJ1-1570, Structural engineering (General), TA630-695

وصف الملف: electronic resource

Relation: https://www.fracturae.com/index.php/fis/article/view/4476/3937; https://doaj.org/toc/1971-8993

URL الوصول: https://doaj.org/article/ca10cac375bd4d29b19bafe56c5d07f5

المؤلفون: Zhiwen Qin, Xiaofei Song, Caicai Liao, Lu Yu, Xin Liu, Shu Yan, Xinkai Li

المصدر: Heliyon, Vol 10, Iss 5, Pp e26679- (2024)

مصطلحات موضوعية: Sandwich structure, Core machining configuration, Core thickness, In-plane compressive, Failure load, Failure mode, Science (General), Q1-390, Social sciences (General), H1-99

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2405844024027105; https://doaj.org/toc/2405-8440

URL الوصول: https://doaj.org/article/3d203786c6de47bf81515cf9b0335d37

المؤلفون: Gang Han, Kanjun Zhang, Yongxin Chen, Jie Teng, Aihong Tang, Huiyuan Yang

المصدر: Energy Reports, Vol 9, Iss , Pp 1588-1596 (2023)

مصطلحات موضوعية: Operational reliability assessment, Failure load level, Discrete convolution, Sequential Monte Carlo method, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2352484723005942; https://doaj.org/toc/2352-4847

URL الوصول: https://doaj.org/article/a6f00cae88b148f985368feb7eb3d1f4

المؤلفون: Lei, Anmin, Zou, Peng, Deng, Fanchen, Yao, Zhenglan

المصدر: 2020 3rd International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE) AEMCSE Advanced Electronic Materials, Computers and Software Engineering (AEMCSE), 2020 3rd International Conference on. :628-630 Apr, 2020

Relation: 2020 3rd International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE)

المؤلفون: Gupta, Akash, Singh, Manjeet

المصدر: World Journal of Engineering, 2022, Vol. 20, Issue 4, pp. 621-630.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/WJE-11-2021-0631

المؤلفون: Tan, Linlin^Aff42

المساهمون: Angrisani, Leopoldo, Series Editor^Aff1, Arteaga, Marco, Series Editor^Aff2, Panigrahi, Bijaya Ketan, Series Editor^Aff3, Chakraborty, Samarjit, Series Editor^Aff4, Chen, Jiming, Series Editor^Aff5, Chen, Shanben, Series Editor^Aff6, Chen, Tan Kay, Series Editor^Aff7, Dillmann, Rüdiger, Series Editor^Aff8, Duan, Haibin, Series Editor^Aff9, Ferrari, Gianluigi, Series Editor^Aff10, Ferre, Manuel, Series Editor^Aff11, Hirche, Sandra, Series Editor^Aff12, Jabbari, Faryar, Series Editor^Aff13, Jia, Limin, Series Editor^Aff14, Kacprzyk, Janusz, Series Editor^Aff15, Khamis, Alaa, Series Editor^Aff16, Kroeger, Torsten, Series Editor^Aff17, Li, Yong, Series Editor^Aff18, Liang, Qilian, Series Editor^Aff19, Martín, Ferran, Series Editor^Aff20, Ming, Tan Cher, Series Editor^Aff21, Minker, Wolfgang, Series Editor^Aff22, Misra, Pradeep, Series Editor^Aff23, Möller, Sebastian, Series Editor^Aff24, Mukhopadhyay, Subhas, Series Editor^Aff25, Ning, Cun-Zheng, Series Editor^Aff26, Nishida, Toyoaki, Series Editor^Aff27, Oneto, Luca, Series Editor^Aff28, Pascucci, Federica, Series Editor^Aff29, Qin, Yong, Series Editor^Aff30, Seng, Gan Woon, Series Editor^Aff31, Speidel, Joachim, Series Editor^Aff32, Veiga, Germano, Series Editor^Aff33, Wu, Haitao, Series Editor^Aff34, Zamboni, Walter, Series Editor^Aff35, Zhang, Junjie James, Series Editor^Aff36, Lee, Sangchul, editor^Aff37, Han, Cheolheui, editor^Aff38, Choi, Jeong-Yeol, editor^Aff39, Kim, Seungkeun, editor^Aff40, Kim, Jeong Ho, editor^Aff41

المصدر: The Proceedings of the 2021 Asia-Pacific International Symposium on Aerospace Technology (APISAT 2021), Volume 1. 912:857-867