المؤلفون: Zhang, Leigang^{Aff1, Aff2}, Xu, Bo, Chen, Zhenqian, Li, Guopei^{Aff1, Aff2}, Zhang, Yonghai^{Aff1, Aff2}, Wu, Xuehong^{Aff1, Aff2, IDs12217024101357_cor6}

المصدر: Microgravity Science and Technology: An International Journal for Microgravity and Space Exploration Related Research. 36(5)

المؤلفون: Tanaka, D., Yuki., K., Unno, N., Yuki, K., Ide, T., Ogushi, T., Murakami, M.

المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :179-180 Apr, 2023

Relation: 2023 International Conference on Electronics Packaging (ICEP)

المؤلفون: Mo, S., Wei, X., Zhang, J., Li, X., Zhao, Z.

المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 29(2):709-717 Apr, 2022

المؤلفون: Shenyang Mo, Xuebao Li, Zhibin Zhao, Xiang Cui

المصدر: CSEE Journal of Power and Energy Systems, Vol 10, Iss 1, Pp 371-380 (2024)

مصطلحات موضوعية: Biased AC voltage, bubble, FC-72, partial discharge, power electronic package, surface discharge, Technology, Physics, QC1-999

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9671039/; https://doaj.org/toc/2096-0042

URL الوصول: https://doaj.org/article/036bb871b95649ac84c96530410e4b48

المؤلفون: Kim, Ji Yong, Mo Kim, Kyung, Bang, In Cheol

المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :184-191 Jul, 2020

Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Mo, Shenyang, Zhao, Zhibin, Li, Xuebao, Cui, Xiang, Xu, Jiayu, Zhang, Jinqiang

المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 27(4):1119-1127 Aug, 2020

المؤلفون: Mo, Shenyang, Li, Xuebao, Zhao, Zhibin, Cui, Xiang, Xu, Jiayu, Fan, Tengfei, Tang, Xinling

المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 27(4):1059-1067 Aug, 2020

المؤلفون: Durgesh Ranjan, Shalabh C. Maroo

المصدر: Advanced Materials Interfaces, Vol 10, Iss 23, Pp n/a-n/a (2023)

مصطلحات موضوعية: evaporation, FC‐72, interfaces, nanochannels, thin films, Physics, QC1-999, Technology

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2196-7350

URL الوصول: https://doaj.org/article/3e7319a2f17f412a99db42882ab196c9

المؤلفون: Cardenas, R., Narayanan, V.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(11):1811-1823 Nov, 2012

المؤلفون: Marjan Goodarzi, Iskander Tlili, Hazim Moria, Tawfeeq Abdullah Alkanhal, R. Ellahi, Ali E. Anqi, Mohammad Reza Safaei

المصدر: Alexandria Engineering Journal, Vol 59, Iss 6, Pp 4511-4521 (2020)

مصطلحات موضوعية: Flow boiling, Nano-suspension, n-pentane, Perfluorohexane (FC-72), Graphene oxide nanoplatelets (GONPs), Pressure drop, Engineering (General). Civil engineering (General), TA1-2040

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S1110016820303811; https://doaj.org/toc/1110-0168

URL الوصول: https://doaj.org/article/2ba99a7bd606488c99c23f9cf0b4a5c9