-
1دورية أكاديمية
المؤلفون: Zhang, LeigangAff1, Aff2, Xu, Bo, Chen, Zhenqian, Li, GuopeiAff1, Aff2, Zhang, YonghaiAff1, Aff2, Wu, XuehongAff1, Aff2, IDs12217024101357_cor6
المصدر: Microgravity Science and Technology: An International Journal for Microgravity and Space Exploration Related Research. 36(5)
-
2مؤتمر
المؤلفون: Tanaka, D., Yuki., K., Unno, N., Yuki, K., Ide, T., Ogushi, T., Murakami, M.
المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :179-180 Apr, 2023
Relation: 2023 International Conference on Electronics Packaging (ICEP)
-
3دورية أكاديمية
المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 29(2):709-717 Apr, 2022
-
4دورية أكاديمية
المؤلفون: Shenyang Mo, Xuebao Li, Zhibin Zhao, Xiang Cui
المصدر: CSEE Journal of Power and Energy Systems, Vol 10, Iss 1, Pp 371-380 (2024)
مصطلحات موضوعية: Biased AC voltage, bubble, FC-72, partial discharge, power electronic package, surface discharge, Technology, Physics, QC1-999
وصف الملف: electronic resource
-
5مؤتمر
المؤلفون: Kim, Ji Yong, Mo Kim, Kyung, Bang, In Cheol
المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :184-191 Jul, 2020
Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
-
6دورية أكاديمية
المؤلفون: Mo, Shenyang, Zhao, Zhibin, Li, Xuebao, Cui, Xiang, Xu, Jiayu, Zhang, Jinqiang
المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 27(4):1119-1127 Aug, 2020
-
7دورية أكاديمية
المؤلفون: Mo, Shenyang, Li, Xuebao, Zhao, Zhibin, Cui, Xiang, Xu, Jiayu, Fan, Tengfei, Tang, Xinling
المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 27(4):1059-1067 Aug, 2020
-
8دورية أكاديمية
المؤلفون: Durgesh Ranjan, Shalabh C. Maroo
المصدر: Advanced Materials Interfaces, Vol 10, Iss 23, Pp n/a-n/a (2023)
مصطلحات موضوعية: evaporation, FC‐72, interfaces, nanochannels, thin films, Physics, QC1-999, Technology
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2196-7350
-
9دورية أكاديمية
المؤلفون: Cardenas, R., Narayanan, V.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(11):1811-1823 Nov, 2012
-
10دورية أكاديمية
المؤلفون: Marjan Goodarzi, Iskander Tlili, Hazim Moria, Tawfeeq Abdullah Alkanhal, R. Ellahi, Ali E. Anqi, Mohammad Reza Safaei
المصدر: Alexandria Engineering Journal, Vol 59, Iss 6, Pp 4511-4521 (2020)
مصطلحات موضوعية: Flow boiling, Nano-suspension, n-pentane, Perfluorohexane (FC-72), Graphene oxide nanoplatelets (GONPs), Pressure drop, Engineering (General). Civil engineering (General), TA1-2040
وصف الملف: electronic resource