-
1مؤتمرTowards Standardization of Hybrid Bonding Interface: In-depth Study of Dielectrics on Direct Bonding
المؤلفون: Yang, Yi, Brun, Xavier F., Weber, Marc H., Flores, Marco
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :599-605 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
-
2مؤتمر
المؤلفون: Brun, Xavier F., Wong, Stephen, Mota, Manuel, Udofia, Edidiong
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :264-268 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
-
3مؤتمر
المصدر: 2024 23rd International Symposium INFOTEH-JAHORINA (INFOTEH) INFOTEH-JAHORINA (INFOTEH), 2024 23rd International Symposium. :1-5 Mar, 2024
Relation: 2024 23rd International Symposium INFOTEH-JAHORINA (INFOTEH)
-
4دورية أكاديمية
المؤلفون: Tiacci, Lorenzo, Rossi, Andrea
المصدر: International Journal of Production Research; Apr2024, Vol. 62 Issue 8, p2769-2791, 23p
مصطلحات موضوعية: SAND casting, FOUNDRY sand, ELECTRIC furnaces, EMISSIONS (Air pollution), GREENHOUSE gas mitigation, JOB shops
-
5
المؤلفون: Sundaram, Dinesh, Matsushita, Taishi, Belov, Ilja, Diószegi, Attila, 1962
المصدر: IFT: JÖNKÖPING Archives of Foundry Engineering. 24(1):94-106
مصطلحات موضوعية: Permeability, Kozeny model, Density, Foundry core, Foundry mold, X-ray microtomography, Component casting, Cast iron
وصف الملف: print
-
6مؤتمر
المؤلفون: Baldania, Mihir
المصدر: 2023 IEEE 11th Region 10 Humanitarian Technology Conference (R10-HTC) Humanitarian Technology Conference (R10-HTC), 2023 IEEE 11th Region 10. :1022-1027 Oct, 2023
Relation: 2023 IEEE 11th Region 10 Humanitarian Technology Conference (R10-HTC)
-
7مؤتمر
المؤلفون: Wang, Kaifeng, Wu, Yongqin, Ren, Ye, Wei, Renjie, Chen, Zerui, Hang, Jianfeng, Wang, Zhixuan, Zhang, Fangxing, Zhang, Lining, Peng, Chunyu, Wu, Xiulong, Ye, Le, Zheng, Kai, Kang, Jin, Wu, Xusheng, Bu, Weihai, Huang, Ru, Huang, Qianqian
المصدر: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2023 - IEEE 53rd European. :13-16 Sep, 2023
Relation: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC)
-
8مؤتمر
المؤلفون: Liu, Jung-Hui, Zhou, Kai-Yan, Tsai, Chi-Sheng
المصدر: 2023 IEEE 6th International Conference on Knowledge Innovation and Invention (ICKII) Knowledge Innovation and Invention (ICKII), 2023 IEEE 6th International Conference on. :768-772 Aug, 2023
Relation: 2023 IEEE 6th International Conference on Knowledge Innovation and Invention (ICKII)
-
9مؤتمر
المؤلفون: Feng, Kaiyin, Koscica, Rosalyn, Shang, Chen, Skipper, Alec, Netherton, Andrew, Clark, Andrew, Ludewig, Peter, Harame, David, Bowers, John E.
المصدر: 2024 IEEE Silicon Photonics Conference (SiPhotonics) Silicon Photonics Conference (SiPhotonics), 2024 IEEE. :1-2 Apr, 2024
Relation: 2024 IEEE Silicon Photonics Conference (SiPhotonics)
-
10مؤتمر
المصدر: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-6 Jul, 2023
Relation: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Full Text Finder 
PDF full text from Publisher