المؤلفون: Liang, Zhangang, Liu, Falin

المصدر: 2024 IEEE International Conference on Computational Electromagnetics (ICCEM) Computational Electromagnetics (ICCEM), 2024 IEEE International Conference on. :1-3 Apr, 2024

Relation: 2024 IEEE International Conference on Computational Electromagnetics (ICCEM)

المؤلفون: Bai, Qiong, Xin, Jinming, Yan, Ming, Wang, Yu, Li, Erpeng, Zhao, Sanjun

المصدر: 2020 Chinese Automation Congress (CAC) Automation Congress (CAC), 2020 Chinese. :4975-4980 Nov, 2020

Relation: 2020 Chinese Automation Congress (CAC)

المؤلفون: Wei, F., Cheng, X.Y., Liu, Y.X., Shi, X.W.

المصدر: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 67(11):2467-2471 Nov, 2020

المؤلفون: Yue Gou, Hui Feng Ma, Shi Sun, Tai Yi Zhang, Liang Wei Wu, Zheng Xing Wang, Sen Zheng, Tie Jun Cui

المصدر: Small Structures, Vol 4, Iss 9, Pp n/a-n/a (2023)

مصطلحات موضوعية: four channels, metaholography, metaprinting, metasurface, non-interleaved, Physics, QC1-999, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2688-4062

URL الوصول: https://doaj.org/article/75b30675b6ba4ddca2643f37210a5788

المؤلفون: Wong, S., Deng, F., Lin, J., Wu, Y., Zhu, L., Chu, Q.

المصدر: IEEE Microwave and Wireless Components Letters IEEE Microw. Wireless Compon. Lett. Microwave and Wireless Components Letters, IEEE. 27(8):709-711 Aug, 2017

المؤلفون: Jinming, Tian, Jianyin, Gu, Rongfang, Zong, Chenglong, Gong

المصدر: 2011 Third International Conference on Measuring Technology and Mechatronics Automation Measuring Technology and Mechatronics Automation (ICMTMA), 2011 Third International Conference on. 1:1002-1005 Jan, 2011

Relation: 2011 International Conference on Measuring Technology and Mechatronics Automation (ICMTMA)

المؤلفون: Aka, Philip C.^Aff2

المساهمون: Aka, Philip C.^Aff1

المصدر: Genetic Counseling and Preventive Medicine in Post-War Bosnia. :31-42

المؤلفون: Perrier, A.-L., Goebel, J.-C., Pinzano-Watrin, A., Roeder, E., Gillet, P., Grenier, D., Beuf, O.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 13(6):2450-2458 Jun, 2013

المؤلفون: Fan Yang, Bowen Zhang, Leijun Song

المصدر: Micromachines, Vol 13, Iss 11, p 1817 (2022)

مصطلحات موضوعية: system in package (SIP), Ku-band, four channels, high temperature co-fired ceramics (HTCC), Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/13/11/1817; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/243d7038198e404781b29b607a48a1c2

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.