المؤلفون: Klein, Levente J., Marianno, Fernando J., Hamman, Hendrik F., Claassen, Alan

المصدر: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 15th IEEE Intersociety Conference on. :1306-1311 May, 2016

Relation: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Khalid, R., Wemhoff, A.P., Joshi, Y.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 7(9):1440-1452 Sep, 2017

المؤلفون: David, Milnes P., Iyengar, Madhusudan K., Parida, Pritish, Simons, Robert E., Schultz, Mark, Gaynes, Michael, Schmidt, Roger, Chainer, Timothy

المصدر: 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on. :562-573 May, 2012

Relation: 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Jun Dai, Das, Diganta, Pecht, Michael, Ohadi, Michael

المصدر: 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE. :82-86 Mar, 2012

Relation: 2012 IEEE/CPMT 28th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM)

المؤلفون: Enlund, Svante, Lunden, Dag

المصدر: 2011 IEEE 33rd International Telecommunications Energy Conference (INTELEC) Telecommunications Energy Conference (INTELEC), 2011 IEEE 33rd International. :1-4 Oct, 2011

Relation: INTELEC 2011 - 2011 33rd International Telecommunications Energy Conference

المؤلفون: Dai, Jun, Das, Diganta, Pecht, Michael

المصدر: 2011 IEEE EUROCON - International Conference on Computer as a Tool EUROCON - International Conference on Computer as a Tool (EUROCON), 2011 IEEE. :1-4 Apr, 2011

Relation: IEEE EUROCON 2011 - International Conference on Computer as a Tool (EUROCON)

المساهمون: Tschudi, William

وصف الملف: Medium: ED

URL الوصول: http://www.osti.gov/scitech/servlets/purl/1045922

المؤلفون: Coles, Henry C.

مصطلحات موضوعية: Energy conservation, consumption, and utilization, data center contamination, gaseous contamination, air-side economizer, corrosion coupon, IT equipment reliability, copper corrosion rate, silver corrosion rate, free-air cooling, outside-air cooling, silver corrosion coupon, copper corrosion coupon, corrosion classification coupon

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/69n17392

المؤلفون: Arghode, Vaibhav K.^Aff4, Joshi, Yogendra^Aff5

المساهمون: Kacprzyk, Janusz, Series editor^Aff1, Arghode, Vaibhav K.^Aff2, Joshi, Yogendra^Aff3

المصدر: Air Flow Management in Raised Floor Data Centers. :59-66

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