المؤلفون: Pfeifer, F., Bronner, A., Seiferling, F., Wilde, J.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(6):7625-7635 Mar, 2024

المؤلفون: Yang, Yanan, Li, Yi, Yang, Jun, Yin, Luqiao, Chen, Longlong, Zhang, Jianhua

المصدر: 2019 20th International Conference on Electronic Packaging Technology(ICEPT) Electronic Packaging Technology(ICEPT), 2019 20th International Conference on. :1-4 Aug, 2019

Relation: 2019 20th International Conference on Electronic Packaging Technology(ICEPT)

المؤلفون: Kim, Joon Hyub, Bum Kim, Ki, Lee, Sang Ki, Ki Min, Nam, Park, Chan won

المصدر: 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), 2019 20th International Conference on. :1997-2000 Jun, 2019

Relation: 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

المؤلفون: Tian, Rui, Yin, Luqiao, Li, Yi, Zhang, Jianhua, Wang, Yibin

المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :1097-1101 Aug, 2018

Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Tian, Rui, Li, Yi, Yin, Luqiao, Zhang, Jianhua

المصدر: 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2017 18th International Conference on. :844-849 Aug, 2017

Relation: 2017 18th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Peixin Zhong, Genyu Chen, Shaoxiang Cheng, Mingquan Li

المصدر: Journal of Materials Research and Technology, Vol 20, Iss , Pp 2309-2322 (2022)

مصطلحات موضوعية: Laser technique, Glass frit bonding, Laser pre-sintering, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785422012236; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/1a908a51ee474a55b97042c07a909da1

المؤلفون: Ham, S., Kim, K., Kim, J., Min, N., Choi, W., Park, C.

المصدر: 2015 IEEE International Workshop of Electronics, Control, Measurement, Signals and their Application to Mechatronics (ECMSM) Electronics, Control, Measurement, Signals and their Application to Mechatronics (ECMSM), 2015 IEEE International Workshop of. :1-5 Jun, 2015

Relation: 2015 IEEE International Workshop of Electronics, Control, Measurement, Signals and their application to Mechatronics (ECMSM)

المؤلفون: Ji-Hoon Han, Sung Joon Min, Eun-Sang Lee, Joon Hyub Kim, Nam Ki Min

المصدر: Sensors, Vol 23, Iss 20, p 8390 (2023)

مصطلحات موضوعية: strain gauge, bulk micromachining, SiOG MEMS, glass frit bonding, pressure sensor, Chemical technology, TP1-1185

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1424-8220/23/20/8390; https://doaj.org/toc/1424-8220

URL الوصول: https://doaj.org/article/cc89fbdcedf04b88b29ec219fa956685

المؤلفون: Sandvand, A., Halvorsen, E., Aasmundtveit, K.E., Jakobsen, H.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 5(11):1559-1566 Nov, 2015

المؤلفون: Knechtel, Roy^Aff9, Schwarz, Uwe^Aff10

المساهمون: Ceccarelli, Marco, Series Editor^Aff1, Hernandez, Alfonso, Editorial Board Member^Aff2, Huang, Tian, Editorial Board Member^Aff3, Takeda, Yukio, Editorial Board Member^Aff4, Corves, Burkhard, Editorial Board Member^Aff5, Agrawal, Sunil, Editorial Board Member^Aff6, Zentner, Lena, editor^Aff7, Strehle, Steffen, editor^Aff8

المصدر: Microactuators, Microsensors and Micromechanisms : MAMM 2020. 96:89-102