يعرض 1 - 10 نتائج من 321 نتيجة بحث عن '"hdds"', وقت الاستعلام: 0.89s تنقيح النتائج
  1. 1
    مؤتمر

    المصدر: 2024 International Conference on Control, Automation and Diagnosis (ICCAD) Control, Automation and Diagnosis (ICCAD), 2024 International Conference on. :1-6 May, 2024

    Relation: 2024 International Conference on Control, Automation and Diagnosis (ICCAD)

  2. 2
    مؤتمر

    المصدر: 2023 3rd International Conference on Innovative Mechanisms for Industry Applications (ICIMIA) Innovative Mechanisms for Industry Applications (ICIMIA), 2023 3rd International Conference on. :875-880 Dec, 2023

    Relation: 2023 3rd International Conference on Innovative Mechanisms for Industry Applications (ICIMIA)

  3. 3
    دورية أكاديمية

    المصدر: IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 59(11):1-5 Nov, 2023

  4. 4
    دورية أكاديمية

    المؤلفون: Yabui, S., Atsumi, T., Inoue, T.

    المصدر: IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 58(1):1-11 Jan, 2022

  5. 5
    دورية أكاديمية

    المؤلفون: Charamba, VonaiAff1, IDs1257102301388y_cor1, Kazembe, Lawrence N., Nickanor, Ndeyapo

    المصدر: Food Security: The Science, Sociology and Economics of Food Production and Access to Food. 15(5):1383-1398

  6. 6
  7. 7
    مؤتمر

    المؤلفون: Zeydan, Engin, Arslan, Suayb S.

    المصدر: 2020 23rd Conference on Innovation in Clouds, Internet and Networks and Workshops (ICIN) Innovation in Clouds, Internet and Networks and Workshops (ICIN), 2020 23rd Conference on. :243-249 Feb, 2020

    Relation: 2020 23rd Conference on Innovation in Clouds, Internet and Networks and Workshops (ICIN)

  8. 8
    دورية أكاديمية

    المؤلفون: Yoon, S., Hwang, E.

    المصدر: IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 57(3):1-5 Mar, 2021

  9. 9
    مؤتمر

    المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :235-236 May, 2022

    Relation: 2022 International Conference on Electronics Packaging (ICEP)

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