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1دورية أكاديمية
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(2):221-228 Feb, 2024
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2مؤتمر
المؤلفون: Malakoutian, Mohamadali, Chowdhury, Srabanti
المصدر: 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), 2023 IEEE. :128-131 Oct, 2023
Relation: 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)
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3مؤتمر
المؤلفون: Luo, Kai, Li, Chen, Santi, Enrico
المصدر: 2023 IEEE Electric Ship Technologies Symposium (ESTS) Electric Ship Technologies Symposium (ESTS), 2023 IEEE. :337-342 Aug, 2023
Relation: 2023 IEEE Electric Ship Technologies Symposium (ESTS)
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4مؤتمر
المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-6 May, 2023
Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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5مؤتمر
المؤلفون: Moss, Alex, Antoniou, Antonia, Smet, Vanessa
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :2087-2092 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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6دورية أكاديمية
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(3):323-331 Mar, 2023
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7مؤتمر
المؤلفون: Botau, Aurelian, Negrea, Catalin
المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :528-532 Sep, 2022
Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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8مؤتمر
المؤلفون: Mehlman, Yoni, Levin, Sharon, Mistele, David, Hayek, Naseem, Nierenberg, Nir, Shapira, Shye
المصدر: 2022 IEEE 23rd Workshop on Control and Modeling for Power Electronics (COMPEL) Control and Modeling for Power Electronics (COMPEL), 2022 IEEE 23rd Workshop on. :1-5 Jun, 2022
Relation: 2022 IEEE 23rd Workshop on Control and Modeling for Power Electronics (COMPEL)
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9دورية أكاديمية
المؤلفون: Radchenko, Ilia, Takahashi, Wataru, Takahashi, Hidebumi, Sasahara, HiroyukiAff1, IDs0017002312474y_cor4
المصدر: The International Journal of Advanced Manufacturing Technology. 129(7-8):3141-3154
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10مؤتمر
المؤلفون: Struss, Quentin, Coudrain, Perceval, Colonna, Jean-Philippe, Souifi, Abdelkader, Gontrand, Christian, Deschaseaux, Edouard, Mauguen, Gaelle, Mathieu, Vincent, Magis, Thomas, Simon, Gilles, Frechette, Luc G.
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :2259-2265 Jun, 2020
Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)