يعرض 1 - 10 نتائج من 301 نتيجة بحث عن '"heat spreading"', وقت الاستعلام: 1.06s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Enhanced Heat Spreading Performance of Printed Circuit Boards by Vapor Chamber Implementation

    المؤلفون: Yu, J., Liao, C., Chang, Y., Huang, H., Wang, C., Hung, C.

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(2):221-228 Feb, 2024

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  2. 2
    مؤتمر
    On Extracting the Maximum Power Density at High Frequencies from Gallium Nitride and Related Materials

    المؤلفون: Malakoutian, Mohamadali, Chowdhury, Srabanti

    المصدر: 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), 2023 IEEE. :128-131 Oct, 2023

    Relation: 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)

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  3. 3
    مؤتمر
    Performance Demonstration of a Dropwise Vapor Chamber for Highly Efficient Heat Spreading for Power Electronics

    المؤلفون: Luo, Kai, Li, Chen, Santi, Enrico

    المصدر: 2023 IEEE Electric Ship Technologies Symposium (ESTS) Electric Ship Technologies Symposium (ESTS), 2023 IEEE. :337-342 Aug, 2023

    Relation: 2023 IEEE Electric Ship Technologies Symposium (ESTS)

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  4. 4
    مؤتمر
    Thermal Performance of a Liquid-cooling Assisted Thin Wickless Vapor Chamber

    المؤلفون: Mukhopadhyay, Arani, Pal, Anish, Gukeh, Mohamad Jafari, Megaridis, Constantine M.

    المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-6 May, 2023

    Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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  5. 5
    مؤتمر
    High Performance, Multilayer Copper-Graphene Micro-Foam Wicks for Vapor Chambers

    المؤلفون: Moss, Alex, Antoniou, Antonia, Smet, Vanessa

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :2087-2092 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  6. 6
    دورية أكاديمية
    Thermal Circuit Models of Microstrip Lines Based on Precise Heat Spreading Angles and Convection Boundary Conditions

    المؤلفون: Xiao, Q., Tang, M., Mao, J.

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(3):323-331 Mar, 2023

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  7. 7
    مؤتمر
    Thermal behavior of FR4 and flexible substrates for high output IR LEDs application

    المؤلفون: Botau, Aurelian, Negrea, Catalin

    المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :528-532 Sep, 2022

    Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

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  8. 8
    مؤتمر
    Performance Enhancements of Low-Voltage LDMOS Power Switches by In-chip Integration of a Microcrystalline Diamond Substrate

    المؤلفون: Mehlman, Yoni, Levin, Sharon, Mistele, David, Hayek, Naseem, Nierenberg, Nir, Shapira, Shye

    المصدر: 2022 IEEE 23rd Workshop on Control and Modeling for Power Electronics (COMPEL) Control and Modeling for Power Electronics (COMPEL), 2022 IEEE 23rd Workshop on. :1-5 Jun, 2022

    Relation: 2022 IEEE 23rd Workshop on Control and Modeling for Power Electronics (COMPEL)

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  9. 9
    دورية أكاديمية
    Effects of internal coolant circulation-based cooling schemes on tool wear in turning SUS304 stainless steel

    المؤلفون: Radchenko, Ilia, Takahashi, Wataru, Takahashi, Hidebumi, Sasahara, HiroyukiAff1, IDs0017002312474y_cor4

    المصدر: The International Journal of Advanced Manufacturing Technology. 129(7-8):3141-3154

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  10. 10
    مؤتمر
    Design and fabrication of an ultra-thin silicon vapor chamber for compact electronic cooling

    المؤلفون: Struss, Quentin, Coudrain, Perceval, Colonna, Jean-Philippe, Souifi, Abdelkader, Gontrand, Christian, Deschaseaux, Edouard, Mauguen, Gaelle, Mathieu, Vincent, Magis, Thomas, Simon, Gilles, Frechette, Luc G.

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :2259-2265 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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