يعرض 1 - 10 نتائج من 3,221 نتيجة بحث عن '"heterogeneous integration"', وقت الاستعلام: 0.82s تنقيح النتائج
  1. 1
    مؤتمر
    Hybrid Interconnect Infrastructure for Inter-Chiplet Communication in Wafer-Scale Systems

    المؤلفون: Safari, Yousef, Mohammadrezaee, Rezvan, Al Saleh, Dima, Vaisband, Boris

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2229-2236 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    A CMP Process for Hybrid Bonding Application with Conventional / nt-Cu and SixNy / SixOy Dielectrics

    المؤلفون: Widodo, T. S., Brun, X. F., Lianto, P., Tan, A., Lie, J., Lim, P., See, G. H.

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2058-2061 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism

    المؤلفون: Chancerel, Francois, Urban, Peter, Slabbekoorn, John, Halas, Simon, Bravin, Julian, Brems, Steven, Uhrmann, Thomas, Wimplinger, Markus, Phommahaxay, Alain, Beyne, Eric

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :343-347 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Development of Next-Generation Chemical Mechanical Planarization Process for Panel-level Heterogeneous Integration

    المؤلفون: Angoua, Francoise, Candadai, Aaditya, Rosales-Yeomans, Daniel, Kornbluth, Yosef, Seneviratne, Dilan, Manepalli, Rahul

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :519-522 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Aluminum to copper thermal compression bonding for heterogeneous integration of legacy dielets

    المؤلفون: Sahoo, Krutikesh, Harish, Vineeth, Liu, Jui-Han, Irwin, Randall, Yang, Cheng-Ting Michael, Sun, Henry, Iyer, Subramanian S.

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1940-1946 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    3D Heterogeneous Integration with Sub-3μm Bond Pitch Chip-to-Wafer Hybrid Bonding

    المؤلفون: Shi, Yi, Niazi, Haris Khan, Rosshirt, Michael A., Paletti, Saritha Kumari, Brun, Xavier F.

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :51-55 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    The Energy-Efficient 10-Chiplet AI Hyperscale NPU on Large-Scale Advanced Package

    المؤلفون: Yoon, Jiwon, Kwon, Youngsu, Kim, Hyunwoo, Lee, Juhyeon, Kim, Joungho, Kim, Sungjin, Jang, Heejun, Ahn, Kyun, Kim, Jinhan, Hwang, Taekyeong, Kim, Yi-Gyeong, Choi, Minseok

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1687-1693 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    Novel Low Thermal Budget Bonding Using Single Wafer Thermal Processing System, Resulting in Excellent Wafer-to-Wafer Hybrid Bonding at sub-0.5um Pitch

    المؤلفون: Gorchichko, Mariia, Sharma, Shashank, Ng, Ben, Sherwood, Tyler, Jeon, Yoocharn, Mcintyre, Dylan, Li, Kun, Singh, Sarabjot, Iler, Evan, Knapp, David, Prakash, Amit, Nguen, Viet, Sreenivasan, Raghav, Krishnan, Siddarth, Chudzik, Michael

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :404-407 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    Bump-Less Interconnect with Room Temperature Pre-Bondable Adhesive and Solder for High Throughput Chip Stacking

    المؤلفون: Okada, Wataru, Nakamura, Yuzo, Kayaba, Yasuhisa, Shikama, Takuo, Hisamune, Yutaka, Tamura, Kahori, Inada, Satoshi, Furusho, Rikia

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :357-362 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  10. 10
    مؤتمر
    Comparison of Organic and Inorganic Dielectric Hybrid Bonding with Highly -Oriented Nanotwinned Cu

    المؤلفون: He, Pin-Syuan, Chen, Chih

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1998-2002 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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