المؤلفون: Ong, Jia Juen, Shie, Kai-Cheng, Tu, King-Ning, Chen, Chih

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :203-210 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Kai-Cheng Shie, Shih-Chi Yang, Dinh-Phuc Tran, King-Ning Tu, Chih Chen

المصدر: Materials, Vol 15, Iss 5, p 1888 (2022)

مصطلحات موضوعية: Cu/SiO2 hybrid bonding, highly (111)-nanotwinned Cu, low temperature bonding, microelectronic packaging, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/15/5/1888; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/277bad7c4c904d249e62bf45845afc01

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