المؤلفون: Huang, Ke, Zhang, Xinqiao, Koushanfar, Farinaz

المصدر: 2024 IEEE 67th International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2024 IEEE 67th International Midwest Symposium on. :678-682 Aug, 2024

Relation: 2024 IEEE 67th International Midwest Symposium on Circuits and Systems (MWSCAS)

المؤلفون: Banerjee, Aritra

المصدر: 2024 IEEE 67th International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2024 IEEE 67th International Midwest Symposium on. :764-768 Aug, 2024

Relation: 2024 IEEE 67th International Midwest Symposium on Circuits and Systems (MWSCAS)

المؤلفون: Jaramillo-Toral, Uriel, Garcia-Lopez, Juan Carlos, Ortega-Cisneros, S., Baungarten-Leon, Emilio Isaac, Torres-Gonzalez, Cristian, Sandoval-Ibarra, F.

المصدر: 2024 IEEE 67th International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2024 IEEE 67th International Midwest Symposium on. :1393-1397 Aug, 2024

Relation: 2024 IEEE 67th International Midwest Symposium on Circuits and Systems (MWSCAS)

المؤلفون: Lei, Fenghua, Lu, Weier, Liu, Fanyu, Li, Bo, Wang, Jiajia, Li, Jiangjiang

المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Huang, Zhiqiang, Liu, Jianxiong, Wang, Min, Liu, Bing, Chen, Xuanlong

المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Zhao, Zhiyan, Wan, Guoshun, Jia, Yuxi

المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Zia, Amirhussein, Naeiji, Soroush, Shen, Z. John

المصدر: 2024 IEEE Sixth International Conference on DC Microgrids (ICDCM) DC Microgrids (ICDCM), 2024 IEEE Sixth International Conference on. :1-7 Aug, 2024

Relation: 2024 IEEE Sixth International Conference on DC Microgrids (ICDCM)

المؤلفون: Vutukuru, Manoj Yasaswi, Muha, Andrew, Srinivasan, Ramesh, Jha, Rashmi

المصدر: NAECON 2024 - IEEE National Aerospace and Electronics Conference NAECON 2024 - IEEE National, Aerospace and Electronics Conference. :297-300 Jul, 2024

Relation: NAECON 2024 - IEEE National Aerospace and Electronics Conference

المؤلفون: Takahashi, Hiroaki, Kitagawa, Hayato, Schlaffer, Erich, Paulitsch, Helmut, Bosch, Wolfgang

المصدر: 2024 International Conference on Broadband Communications for Next Generation Networks and Multimedia Applications (CoBCom) Broadband Communications for Next Generation Networks and Multimedia Applications (CoBCom), 2024 International Conference on. :1-7 Jul, 2024

Relation: 2024 International Conference on Broadband Communications for Next Generation Networks and Multimedia Applications (CoBCom)

المؤلفون: Preethi, Konkathi, Li, Xiaojun, Fernandez-Moran, Roberto, Liu, Xiangzhuo, Xing, Zanpin, Frappart, F., Piles, Maria, Lanka, Karthikeyan, Wigneron, Jean-Pierre

المصدر: IGARSS 2024 - 2024 IEEE International Geoscience and Remote Sensing Symposium Geoscience and Remote Sensing Symposium, IGARSS 2024 - 2024 IEEE International. :6701-6704 Jul, 2024

Relation: IGARSS 2024 - 2024 IEEE International Geoscience and Remote Sensing Symposium