المؤلفون: Khurana, Gaurav, Panchenko, Iuliana

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :866-871 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Stegmann, Tamira, Schwobel, Andre, Schmitt, Wolfgang, Gunst, Stefan, Durst, Karsten, Klar, Peter, Neugebauer, Nils, Dornseifer, Jan Luka

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :635-642 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Gupta, Ashish, Kalal, Shailesh, A, Akshaya, Stahn, Jochen, Gupta, Mukul^{Aff1, IDs10948024068048_cor5}

المصدر: Journal of Superconductivity and Novel Magnetism. :1-7

المؤلفون: Nisar, Jamila^{Aff1, Aff2}, Giddey, Sarbjit^{Aff1, IDs1158102405651w_cor2}, Kaur, Gurpreet, Kulkarni, Aniruddha P., Biswas, Saheli, Jones, Lathe A., Bhargava, Suresh K.

المصدر: Ionics: International Journal of Ionics – The Science and Technology of Ionic Motion. :1-14

المؤلفون: Salifu, Smith^{Aff1, IDs00170024136946_cor1}, Olubambi, Peter Apata

المصدر: The International Journal of Advanced Manufacturing Technology. 132(11-12):6019-6031

المؤلفون: Xie, Yuqi, Liu, Junkai^{Aff1, Aff2, Aff3, IDs11666024017677_cor2}, Luo, Junhui, Li, Qian, Zhang, Jianquan, Yang, Li^{Aff1, Aff2, Aff3, IDs11666024017677_cor6}, Zhou, Yichun^{Aff1, Aff2, Aff3}

المصدر: Journal of Thermal Spray Technology. 33(5):1510-1525

المؤلفون: Bian, Baixue, Liu, Yuling^{Aff1, IDs1166902401121y_cor2}, Du, Yong^{Aff1, IDs1166902401121y_cor3}, Wen, Shiyi, Kong, Yi, Min, Qianhui, Liu, Huixin, Zhou, Peng, Mo, Chuan, Fa, Tao, Wang, Xiaolin

المصدر: Journal of Phase Equilibria and Diffusion. :1-21

المؤلفون: Haribabu, S., Sudha, C.^{Aff1, Aff2, IDs11669024011187_cor2}, Ganesh, P., Kumar, Abhay

المصدر: Journal of Phase Equilibria and Diffusion. :1-18

المؤلفون: Liu, Xiao, Zhang, Boning^{Aff1, IDs11665024095303_cor2}, Wang, Guowei, Liu, Lan, Tang, Yan, Zheng, Lei^{Aff1, IDs11665024095303_cor6}

المصدر: Journal of Materials Engineering and Performance. :1-8

المؤلفون: Skowronski, M.

المصدر: 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-5 Mar, 2023

Relation: 2023 IEEE International Reliability Physics Symposium (IRPS)