-
1دورية أكاديمية
المؤلفون: Wang, KeAff1, Aff2, Zhang, Fanxing, Cao, Ning, Bao, Ying, Yan, MiAff3, Aff4, Yan, KepingAff1, Aff5, Xie, PengfeiAff1, Aff2, Aff4, IDs1142602319956_cor7
المصدر: Science China Chemistry. :1-9
-
2دورية أكاديمية
المؤلفون: Ding, WeibingAff1, Aff3, Yang, QianwenAff1, Aff3, Zhao, YaohuiAff1, Aff3, Wang, ZhaohuiAff1, Aff3, IDs11814024000263_cor4, Chen, Jie, Wang, Hongxia
المصدر: Korean Journal of Chemical Engineering. 41(1):157-174
-
3دورية أكاديمية
المؤلفون: Walt Yang, Madison M. Foreman, Steven Saric, Alec M. Wodtke, Kevin R. Wilson, Daniel M. Neumark
المصدر: Natural Sciences, Vol 4, Iss 2-3, Pp n/a-n/a (2024)
مصطلحات موضوعية: energy transfer, flat liquid jets, interfacial dynamics, kinematic modeling, molecular beam scattering, water interface, Science
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2698-6248
-
4دورية أكاديمية
المؤلفون: Rajesh, Sreeram, Peddada, Sumukh S, Thiévenaz, Virgile, Sauret, Alban
مصطلحات موضوعية: Fluid Mechanics and Thermal Engineering, Engineering, Interfacial dynamics, Bubble, Pinch-off, Singularities, Polymer solution, Viscoelasticity, Mathematical Sciences, Physical Sciences, Polymers, Mathematical sciences, Physical sciences
URL الوصول: https://escholarship.org/uc/item/1z38g46b
-
5دورية أكاديمية
المؤلفون: Tian, Jian-XinAff1, Aff2, Guo, Hui-JuanAff1, Aff2, Wan, JingAff1, Aff2, Liu, Gui-XianAff1, Aff2, Wen, RuiAff1, Aff2, IDs1142602317786_cor5, Wan, Li-JunAff1, Aff2, IDs1142602317786_cor6
المصدر: Science China Chemistry. 66(10):2921-2928
-
6دورية أكاديمية
المؤلفون: Haichang Yang, Binglin Zeng, Qiuyun Lu, Yaowen Xing, Xiahui Gui, Yijun Cao, Ben Bin Xu, Xuehua Zhang
المصدر: Advanced Materials Interfaces, Vol 11, Iss 14, Pp n/a-n/a (2024)
مصطلحات موضوعية: capillarity, interfacial dynamics, marangoni effect, scaling law, shaping, stability, Physics, QC1-999, Technology
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2196-7350
-
7مؤتمر
المؤلفون: Germain, Thomas, Putnam, Shawn A.
المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :1239-1245 Jul, 2020
Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
-
8دورية أكاديمية
المؤلفون: Chen, YuanAff1, IDs10884022101787_cor1, Promislow, Keith
المصدر: Journal of Dynamics and Differential Equations. 35(2):1785-1841
-
9كتاب إلكتروني
المؤلفون: Tiwari, Utkarsh DeepAff14, Kumar, ParmodAff14
المساهمون: Chaari, Fakher, Series EditorAff1, Gherardini, Francesco, Series EditorAff2, Ivanov, Vitalii, Series EditorAff3, Cavas-Martínez, Francisco, Editorial Board MemberAff4, di Mare, Francesca, Editorial Board MemberAff5, Haddar, Mohamed, Editorial Board MemberAff6, Kwon, Young W., Editorial Board MemberAff7, Trojanowska, Justyna, Editorial Board MemberAff8, Xu, Jinyang, Editorial Board MemberAff9, Sikarwar, Basant Singh, editorAff10, Sharma, Sanjeev Kumar, editorAff11, Jain, Ankur, editorAff12, Singh, Krishna Mohan, editorAff13
المصدر: Advances in Fluid and Thermal Engineering : Select Proceedings of FLAME 2022. :675-697
-
10