المؤلفون: Vu, Thi Thu Nga, Teyssedre, Gilbert, Roy, Severine Le

المصدر: 2024 IEEE 5th International Conference on Dielectrics (ICD) Dielectrics (ICD), 2024 IEEE 5th International Conference on. :1-4 Jun, 2024

Relation: 2024 IEEE 5th International Conference on Dielectrics (ICD)

المؤلفون: Ikeda, Hiroaki, Sekine, Shigenobu, Kimura, Ryuji, Shimokawav, Koichi, Shindo, Hiroaki, Ooi, Tatsuya, Tamaki, Rei

المصدر: 2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia), 2019 IEEE Workshop on. :1-6 May, 2019

Relation: 2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)

المؤلفون: Ikeda, Hiroaki, Sekine, Shigenobu, Kimura, Ryuji, Shimokawa, Koichi, Okada, Keiji, Shindo, Hiroaki, Ooi, Tatsuya, Tamaki, Rei

المصدر: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :381-386 Apr, 2018

Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

المؤلفون: Ikeda, Hiroaki, Sekine, Shigenobu, Kimura, Ryuji, Shimokawa, Koichi, Okada, Keiji, Shindo, Hiroaki, Ooi, Tatsuya, Tamaki, Rei, Nagata, Makoto

المصدر: 2017 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2017 International Conference on. :171-176 Apr, 2017

Relation: 2017 International Conference on Electronics Packaging (ICEP)

المؤلفون: Kamil Anasiewicz, Józef Kuczmaszewski

المصدر: Materials, Vol 16, Iss 23, p 7303 (2023)

مصطلحات موضوعية: adhesive joint, nanoindentation, apparent Young’s modulus, adhesive joint material properties, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/16/23/7303; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/f8603167992646cc85f4cf84ea4f62ed

المؤلفون: Xiaoming Zhao, Wei Xiang, Yaofeng Yang, Ying Wang, Jing Tao, Jinju Huang, Qiu Zhao, Feng Xiao

المصدر: Buildings, Vol 13, Iss 6, p 1420 (2023)

مصطلحات موضوعية: prefabricated RC bridge deck, joint material, flexural performance test, numerical simulation, Building construction, TH1-9745

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2075-5309/13/6/1420; https://doaj.org/toc/2075-5309

URL الوصول: https://doaj.org/article/6aa5ffa7cf7f49f787283b7e43b5439d

المؤلفون: Liren Ban, Weisheng Du, Tianwei Jin, Chengzhi Qi, Xiaozhao Li

المصدر: International Journal of Mining Science and Technology, Vol 31, Iss 3, Pp 413-420 (2021)

مصطلحات موضوعية: Roughness, Joint material properties, Rock joints, Peak shear strength, Asperities, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2095268621000355; https://doaj.org/toc/2095-2686

URL الوصول: https://doaj.org/article/cee40f7cdd2f421e9cc6976355177e4e

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المؤلفون: Chaohui Lin, Longwei Yu, Jingling Zeng, Hebin Wu, Xiaojun Guo, Jianxin Liu, Yongkang Zhang

المصدر: Metals, Vol 11, Iss 11, p 1770 (2021)

مصطلحات موضوعية: oblique laser shock processing, FGH95 superalloy, turbine disk joint material, orthogonal test, variance analysis, range analysis, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2075-4701/11/11/1770; https://doaj.org/toc/2075-4701

URL الوصول: https://doaj.org/article/f3497ed232334e5e96955ebdcd3bd1eb

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