المؤلفون: Blakimé, Alexia, Henriques, Bruno^{Aff2, Aff3, Aff4}, Silva, Filipe S.^{Aff2, Aff4}, Teughels, Wim, Özcan, Mutlu, Souza, Júlio C. M.^{Aff1, Aff2, Aff4, IDs41547023001941_cor6}

المصدر: Lasers in Dental Science. 7(4):167-193

المؤلفون: Saman Sharbaf Kalaghichi, Jan Hoß, Renate Zapf-Gottwick, Jürgen H. Werner

المصدر: Solar, Vol 3, Iss 3, Pp 362-381 (2023)

مصطلحات موضوعية: laser activation, TOPCon solar cells, passivated contact layers, poly Si doping, implied open circuit voltage, sheet conductance, Production of electric energy or power. Powerplants. Central stations, TK1001-1841

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2673-9941/3/3/21; https://doaj.org/toc/2673-9941

URL الوصول: https://doaj.org/article/73e85ff920c443feafcadf70cbc72ed2

المؤلفون: Ermantraut, Eugen, Zimmermann, Andre, Muller, Hagen, Wolf, Marius, Eberhardt, Wolfgang, Ninz, Philipp, Kern, Frank, Gadow, Rainer

المصدر: 2018 13th International Congress Molded Interconnect Devices (MID) Molded Interconnect Devices (MID), 2018 13th International Congress. :1-5 Sep, 2018

Relation: 2018 13th International Congress Molded Interconnect Devices (MID)

المؤلفون: NIINO, Toshiki, WATANABE, Tetsuya, Mori, Miki

المصدر: 2018 13th International Congress Molded Interconnect Devices (MID) Molded Interconnect Devices (MID), 2018 13th International Congress. :1-4 Sep, 2018

Relation: 2018 13th International Congress Molded Interconnect Devices (MID)

المؤلفون: Wang, Li, Suess-Wolf, Robert, Ulm, Michael, Franke, Joerg

المصدر: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :426-429 Apr, 2018

Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

المؤلفون: Ermantraut, E., Muller, H., Eberhardt, W., Ninz, P., Kern, F., Gadow, R., Zimmermann, A.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(1):138-145 Jan, 2019

المؤلفون: Fidan, Mehmet Eren^{Aff1, IDs10266022007291_cor1}, Erdemir, Ali

المصدر: Odontology: Official Journal of the Society of the Nippon Dental University. 111(1):132-141

المؤلفون: Saman Sharbaf Kalaghichi, Jan Hoß, Jonathan Linke, Stefan Lange, Jürgen H. Werner

المصدر: Energies, Vol 17, Iss 6, p 1319 (2024)

مصطلحات موضوعية: passivating contacts, poly-Si layers, laser activation, thermal stability, electrical deactivation, reactivation, Technology

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1073/17/6/1319; https://doaj.org/toc/1996-1073

URL الوصول: https://doaj.org/article/4bec127314564c85a1952d06f6efff94

المؤلفون: Krasnovsky, Jr., A. A.^{Aff1, IDs11182022025521_cor1}, Kozlov, A. S., Benditkis, A. S.

المصدر: Russian Physics Journal. 64(11):2035-2045

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.