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1مؤتمر
المؤلفون: Peng, Chongnan, Tao, Qi, Krivec, Thomas, Casas, Guillermo, Latorre, Salvador, Antretter, Thomas, Macher, Johannes, Fuchs, Peter
المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-7 Apr, 2024
Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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2دورية أكاديمية
المؤلفون: Sahoo, Amiya Kumar, Mishra, Dhananjay R.Aff2, IDs1200802401924w_cor2
المصدر: International Journal on Interactive Design and Manufacturing (IJIDeM). :1-16
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3دورية أكاديمية
المؤلفون: Sahoo, Amiya Kumar, Mishra, Dhananjay R.Aff2, IDs1254102401070z_cor2
المصدر: International Journal of Precision Engineering and Manufacturing. :1-12
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4دورية أكاديمية
المؤلفون: Liu, Xinyi, Yang, SenAff2, Aff3, Gao, Youdong, Xu, Man, Wan, Yu, Wu, Meng, Li, Lin, Wang, Chenzhuo, Zhong, Mian, Wang, Biyi, Jiang, YongAff1, IDs00170024135623_cor11
المصدر: The International Journal of Advanced Manufacturing Technology. 132(9-10):4269-4283
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5دورية أكاديمية
المؤلفون: Tseng, Shih-FengAff1, IDs00170024133834_cor1, Chen, Guan-Lin, Huang, Chien-Yao, Chiang, Donyau, Kuo, Chil-ChyuanAff3, Aff4, Aff5, IDs00170024133834_cor5
المصدر: The International Journal of Advanced Manufacturing Technology. 132(3-4):1557-1572
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6دورية أكاديمية
المصدر: IEEE Microwave and Wireless Technology Letters IEEE Microw. Wireless Tech. Lett. Microwave and Wireless Technology Letters, IEEE. 33(6):791-794 Jun, 2023
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7مؤتمر
المؤلفون: Hassan, Ayman. F., Abidou, Diaa, Elsaid, A., Zahra, W. K.
المصدر: AIP Conference Proceedings; 2024, Vol. 3094 Issue 1, p1-5, 5p
مصطلحات موضوعية: LASER drilling, INTERPOLATION, CARBON dioxide lasers
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8مؤتمر
المؤلفون: Kan, Cheng-Lun, Xie, Han-San, Ho, Chao-Ching, Chang, Ching-Yuan
المصدر: 2022 18th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA) Mechatronic and Embedded Systems and Applications (MESA, 2022 18th IEEE/ASME International Conference on. :1-5 Nov, 2022
Relation: 2022 18th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA)
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9دورية أكاديمية
المصدر: IEEE Transactions on Industrial Informatics IEEE Trans. Ind. Inf. Industrial Informatics, IEEE Transactions on. 19(4):5422-5432 Apr, 2023
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10دورية أكاديمية
المؤلفون: Wei, TaoAff1, Aff2, Sun, ShufengAff1, Aff3, IDs00170024131894_cor2, Zhang, FengyunAff1, Aff2, Aff3, IDs00170024131894_cor3, Wang, Xi, Wang, Pingping, Liu, XunhuanAff1, Aff2, Wang, QinyangAff1, Aff2
المصدر: The International Journal of Advanced Manufacturing Technology. 131(12):5691-5710